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Organic el element surface sealant, method for producing display, and display

A technology for display devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, lighting devices, etc., and can solve problems such as terminal blockage, easy flow of sealants, and reduced viscosity

Active Publication Date: 2011-10-05
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, the viscosity of thermosetting sealant is temporarily lowered by heating during curing, so the sealant tends to flow to the part where the adhesive does not exist originally, and there is a problem that all the terminals connected to the light-emitting element are blocked by this.

Method used

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  • Organic el element surface sealant, method for producing display, and display
  • Organic el element surface sealant, method for producing display, and display
  • Organic el element surface sealant, method for producing display, and display

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0131] 1. Preparation of Sealants

[0132] 100 parts by weight of epoxy resin A and 97 parts by weight of tetrahydromethylphthalic anhydride (RIKASHIDDO MH700, manufactured by Nippon Rika Co., Ltd.) were added to a stirring vessel, and stirred and mixed at 25° C. for 1 hour. 2 parts by weight of γ-glycidoxypropyltrimethoxysilane (KBM-403, manufactured by Shin-Etsu Silicone Co., Ltd.) and 3 parts by weight of tris(dimethylaminomethyl)phenol were added to the mixture. (JER cure 3010, manufactured by Japan Epoxy Resin Co., Ltd.), and then stirred and mixed at 25° C. for 0.5 hour to prepare a sealant.

[0133] (1) Viscosity and storage stability

[0134] The viscosity (initial viscosity) of the prepared sealant was measured with an E-type viscometer at 25° C. and 1.0 rpm.

[0135] Further, the viscosity of the sealant after storage at 25° C. for 24 hours was measured with an E-type viscometer at 25° C. and 1.0 rpm. The ratio of the viscosity after storage to the viscosity befor...

Embodiment 2～3

[0150] 2. Except having changed the heating time in the 2nd process of the manufacturing method of a display device, and the 4th process as shown in Table 1, it carried out similarly to Example 1, and prepared the sealing compound.

Embodiment 4～9

[0152] The sealing compound was evaluated in the same manner as in Example 1, except that the composition of the sealing compound and the heating time in the second step and the fourth step of 2. Display device manufacturing method were changed as shown in Table 1.

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Abstract

Provided is a method for producing a display with which it is possible to seal a light-emitting element, such as an organic EL element, while maintaining the shape of the sealant. Also provided is a surface sealant for organic EL elements that is suitable for the sealing method, as well as a display obtained by curing the surface sealant. The surface sealant comprises an epoxy resin having two or more epoxy groups per molecule, and a curing agent for the epoxy resin. Viscosity as measured at 25 DEG C and 1.0 rpm using an E viscometer is 1.0102-1.0104mPas and the Ball number as measured in accordance with JIS Z0237 with heating at a temperature between 40 and 100 DEG C is 10 or higher.

Description

technical field [0001] The present invention relates to a surface sealing agent for an organic EL element, a method for manufacturing a display device, and a display device. Background technique [0002] In recent years, development of displays and lighting devices using light-emitting elements such as organic EL elements has been progressing. Since these light-emitting elements are degraded by moisture or the like, it is necessary to seal the light-emitting elements from the atmosphere. [0003] Conventionally, the sealing method of light-emitting elements is as follows, that is, via a frame-shaped photocurable adhesive surrounding the light-emitting elements, a sealing cover containing a desiccant is bonded to an element substrate on which the light-emitting elements and terminal electrodes connected to the light-emitting elements are arranged. The method of putting them together (frame sealing method, refer to Patent Documents 1 and 2, etc.). In recent years, in order t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B33/10C09K3/10H01L51/50H05B33/04
CPCH01L51/5237H10K50/8426H10K59/8722H05B33/04
Inventor 山本佑五伊东佑一铃木健司高松靖
Owner MITSUI CHEM INC
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