Copper foil for printed circuit

一种印刷电路、铜箔的技术，应用在印刷电路、印刷电路、印刷电路制造等方向，能够解决蚀刻残留、处理不匀、剥落等问题，达到高集成化提高的效果

Active Publication Date: 2011-10-19
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] However, in such the most basic roughening treatment including copper-cobalt-nickel alloy plating, since the shape of the roughened particles is dendritic, the upper part of the dendrites peels off from the surface of the copper foil. The problem of dusting
In addition, if plating is further performed on such a roughened surface, treatment unevenness may occur
This may cause problems such as etching residue as circuit patterns become smaller

Method used

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  • Copper foil for printed circuit
  • Copper foil for printed circuit
  • Copper foil for printed circuit

Examples

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Embodiment

[0121] Hereinafter, it demonstrates based on an Example and a comparative example. In addition, this Example is just an example, and this invention is not limited to this example, ie, this invention also includes the other form or deformation|transformation contained therein.

[0122] (Example)

[0123] The rolled copper foil was roughened by copper-cobalt-nickel alloy plating within the range of conditions shown below. Attach 17mg / dm 2 Copper, 2000μg / dm 2 of cobalt and 500μg / dm 2 After the nickel, it is washed with water to form a cobalt-nickel alloy coating on it. At this time, the amount of cobalt deposited is 800-1400μg / dm 2 , nickel deposition is 400~600μg / dm 2 .

[0124] The bath composition and plating conditions used are as follows.

[0125] [Bath composition and plating conditions]

[0126] (A) Roughening treatment (Cu-Co-Ni alloy plating)

[0127] Cu: 15.5g / liter

[0128] Co: 6g / L

[0129] Ni: 11g / liter

[0130] pH: 2.5

[0131] Temperature: 30°C

[0132...

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Abstract

A copper foil for printed circuits which comprises a copper foil and, formed on the surfaces thereof, an electrodeposited ternary-alloy layer comprising copper, cobalt, and nickel. The copper foil for printed circuits is characterized in that the electrodeposited layer is constituted of dendritic particles grown on the copper foil surfaces and that the copper foil has been entirely coated with the particles, which comprise particles having a size of 0.1-0.5 [mu]m2, in terms of the area of each particle viewed from over the copper foil surfaces, at a density of 1,000 particles / 10,000 [mu]m2 or lower, particles larger than 0.5 [mu]m2 at a density of 100 particles / 10,000 [mu]m2 or lower, and particles smaller than 0.1 [mu]m2 as the remainder. In a roughening treatment comprising plating with a copper-cobalt-nickel alloy, roughening particles which are being dendritically formed are inhibited from shedding from the surfaces of the copper foil and thereby causing the phenomenon generally called powder falling and resulting in treatment unevenness.

Description

technical field [0001] The present invention relates to a copper foil for a printed circuit, and in particular to a copper foil for a printed circuit capable of reducing dust falling and uneven treatment of a roughened layer formed by copper-cobalt-nickel alloy plating on the surface of the copper foil. The copper foil for printed circuits of the present invention is particularly suitable for use in FPCs (Flexible Printed Circuit, flexible printed circuits) for fine pattern printed circuits and magnetic heads, for example. Background technique [0002] Copper and copper alloy foil (hereinafter referred to as copper foil) has greatly contributed to the development of electrical and electronic related industries, and has become an indispensable existence especially as a printed circuit material. Copper-clad laminates are generally produced by laminating and bonding copper foil for printed circuits to a base material such as a synthetic resin board or film under high temperatur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D3/56C25D7/00H05K1/09
CPCC25D1/04C25D3/58C25D7/0614C25D5/605H05K3/384H05K2201/0355H05K2203/0307H05K2203/0723Y10T428/12049Y10T428/12063Y10T428/12458Y10T428/12514Y10T428/12861Y10T428/12868Y10T428/1291
Inventor 新井英太樋口直树
Owner JX NIPPON MINING & METALS CORP
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