Electron beam cured silicone materials

A technology of organosilicon and electron beam irradiation, which is applied in thin material processing, film/sheet adhesive, transportation and packaging, etc., and can solve problems such as benefit

Inactive Publication Date: 2011-11-02
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] While some silicone PSA formulations provide acceptable performance after solvent removal, some systems benefit from additional crosslinking

Method used

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  • Electron beam cured silicone materials
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  • Electron beam cured silicone materials

Examples

Experimental program
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preparation example Construction

[0029] The pressure-sensitive adhesive of the present invention can be prepared by mixing silicone materials (such as silicone colloids or elastomers) with suitable tackifying resins, hot-melt coating the resulting combination, and using electron beam (E-beam ) to cure by irradiation. In general, any known additives useful in pressure sensitive adhesive formulations (such as dyes, pigments, fillers, flame retardants, rheology modifiers, flow agents, surface active agents, microspheres (such as expandable microspheres, etc.).

[0030] In general, any known tackifying resin can be used, for example, in some embodiments, a silicate tackifying resin can be used. In some exemplary adhesive compositions, a variety of silicate tackifying resins can be used to achieve desired properties.

[0031] Suitable silicate tackifying resins include resins composed of the following structural units: M (i.e., monovalent R' 3 SiO 1 / 2 unit), D (ie, divalent R' 2 SiO 2 / 2 unit), T (ie, trivale...

example

[0047] The following examples illustrate the inventors' surprising discovery that a variety of silicone chemistries can be cured using electron beam (E-Beam) irradiation to obtain pressure sensitive adhesives. The performance of these e-beam cured adhesives was comparable to the same adhesives cured by conventional methods, although the catalysts or initiators required for conventional curing were not used.

[0048] For comparison, three samples were prepared for each of the silicone chemistries. A reference example in which the silicone was not cured, a comparative example in which the silicone was cured by an appropriate conventional method using a catalyst, and an example of the present invention in which the silicone was cured by electron beam irradiation in the absence of a catalyst and an initiator . The peel adhesion and static shear of the samples were determined according to the tests described below.

[0049] Peel Adhesion Test. Peel adhesion was measured using an...

example 2A、2B

[0063] Examples 2A, 2B, and 2C. DC-7355 was coated as is onto PET-3SAC film using a knife coater with a gap of 127 microns. The coated samples were then dried in an oven at 70°C for 15 minutes. The dried samples were passed through an electron beam chamber with an oxygen content <50 ppm having 250 keV and various dose levels: 1 Mrad (EX-2A), 5 Mrad (EX-2B), and 9 Mrad Ladd (EX-2C).

[0064] Series 3: Q2-7735

[0065] See example RE-3. Q2-7735 was coated as is onto PET-3SAC film using a knife coater with a gap of 127 microns. The coated samples were then dried in an oven at 70°C for 15 minutes.

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Abstract

Methods of preparing silicone materials using electron beam curing are described. The materials are hot melt processed and cured in the absence of an effective amount of catalysts and initiators. Both functional and nonfunctionalized silicone materials may be used. Exemplary cured materials include silicone pressure sensitive adhesives, silicone foams, and non-tacky silicone films.

Description

technical field [0001] The present invention relates to silicone materials, including silicone pressure sensitive adhesives, silicone foams, and non-adhesive silicone films. More specifically, this disclosure describes silicone materials that are cured by exposure to electron beam radiation. Background technique [0002] Pressure sensitive adhesives (PSAs) are an important type of material. In general, PSAs adhere to substrates by light pressure (such as finger pressure) and generally do not require any post-curing (such as heat or radiation) to achieve their maximum bond strength. A variety of PSA chemistries are available including, for example, acrylic, rubber, and silicone-based systems. Silicone PSAs provide one or more of the following useful properties: adhesion to low surface energy (LSE) surfaces, fast adhesion with short dwell times, broad service temperature (i.e., at both high and low temperature extremes) performance under conditions), weather resistance (inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C08J3/28C09J7/38
CPCC09J183/04C08J9/32C08J2383/04C08J2207/02C08J3/28C09J7/0207C08J2201/024C08L83/00C09J7/38Y10T428/2852Y10T428/2809Y10T428/249983C08G77/06C08J5/18C09J2301/416C09J183/08
Inventor 刘军钪克莱顿·A·乔治
Owner 3M INNOVATIVE PROPERTIES CO
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