Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

A multi-layer printing and manufacturing method technology, applied in the field of multi-layer printed circuit board and multi-layer printed circuit board manufacturing, can solve the problems of printed circuit board warpage and other problems, and achieve the effect of flat formation
CN102239753BActive Publication Date: 2013-11-06IBIDEN CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
IBIDEN CO LTD
Publication Date
2013-11-06

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Abstract

The present invention provides a multi-layer printed wiring board and a manufacturing method of the multi-layer printed wiring board. This method can form a planar layer flat. The convex part (150a) is formed in the concave part (153a) for planar conductor formation of the upper interlaminar resin insulating layer (150). Therefore, when copper plating is filled into the concave portion (153a) for forming a planar conductor, copper can be deposited not only on the sidewall and bottom surface of the concave portion (153a), but also on the surrounding sidewall of the convex portion (150a). . Thereby, the planar layer (159) can be formed flat.
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Description

technical field

[0001] The present invention relates to a build-up multilayer printed wiring board and a method for manufacturing the multilayer printed wiring board, in particular to a multilayer printed wiring board having a plain conductor and a method for manufacturing the multilayer printed wiring board. Background technique

[0002] In printed wiring boards constituting package substrates for mounting electronic components such as IC chips, a fine pitch circuit structure is required as IC chips become more functional. In order to realize a fine pitch, it has been proposed not to form a circuit by the conventional additive method, but to form a circuit using a laser as shown in Patent Document 1. In the operation of this circuit formation, such as Figure 28 As shown in (B), using the laser in the Figure 28 In the interlaminar resin insulating layer 350 shown in (A), a recess 353b for circuit formation, an opening 351 for forming a via conductor, and a recess 353a for ...

Claims

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