Liquid pore-filling vacuum stitching process

Abstract

The invention discloses a liquid pore-filling vacuum stitching process, which comprises the following steps in turn: washing a ceramic plate with an acid, oil-removing, activation, brownification, pore-filling and stitching. Specifically, the steps are as follows: firstly, using a chemical reagent to treat the ceramic plate and wash off the oxide on the surface of the copper layer; removing oil from the surface of the copper layer; activating the surface of the copper layer; performing the brownification on a through hole in the ceramic plate; filling the through hole with liquid resins; using a resin film-pressing leveling machine to press and level a film; and lastly, using a vacuum stitching machine to stitch the ceramic plate. The liquid pore-filling vacuum stitching process has the advantages that roasting and polishing processes are unnecessary after filling the through hole with liquid resins, the ceramic plate is directly stitched after being pressed and leveled, the process is free from influence son products, the costs of expensive polishing devices and polishing materials are saved, a large amount of electric energy is saved, the bonding force is stronger, the material expanding and shrinking space is increased, the layer separation phenomenon is avoided, the quality is more stable, the layer separation branching phenomenon caused by inconsistent expansion and shrinkage of materials under the effect of high-temperature welding is avoided, and the process is simpler and is more efficient.

Description

Technical field [0001] The invention relates to a liquid pore filling vacuum pressing process. Background technique [0002] The traditional ceramic plate pressing process is followed by resin filling, baking and curing, polishing and leveling, surface treatment, and pressing. The technical implementation of the resin plugging process is as follows: firstly, the circuit is made by the positive-film alkaline etching process, and then the resin is used for plugging (fullness 100-120%), and then the protruding resin is polished off with an abrasive belt , And then use the method of degumming, high-pressure water washing and polishing to remove the resin and copper powder on the surface and hole edges after the sanding belt is polished, and finally perform the normal production of solder mask and post-process procedures to achieve this type of printed circuit board The quality requirements. [0003] The traditional plug hole method needs to dry the via hole on the ceramic plate befor...

AI Technical Summary

Problems solved by technology

Grinding will cause material deformation, resulting in displacement of conductive points, resulting in open and short circuits. Grinding will result in smooth surface and poor bonding force with semi-cured resin, which is easy to produce detachment. The cured resin is hard and difficult to polish. Expensive equipment must be used, and expensive Ceramic brushes are expensive and consume a lot of power

[0004] Before the traditional ceramic plate is pressed, the resin in the via hole of the ceramic plate is solid or semi-solid, and the resin layer resin is also semi-solid. After pressing, it cannot be integrated, and it is easy to crack when heated and expand.

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