Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp

A technology for LED lamps and insulating devices, which is applied to circuit layout, lighting devices, components of lighting devices, etc., can solve the problem of unfavorable heat dissipation of the insulating layer, and achieve the effects of improving heat dissipation effect, reducing light decay, and reliable insulation.

Inactive Publication Date: 2011-11-23
CHANGZHOU XINHUA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

An overly thick insulating layer is not good for heat dissipation, which is a contradiction

Method used

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  • Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp
  • Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp
  • Heat dissipation and circuit insulating device of high-power light emitting diode (LED) lamp

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Experimental program
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Effect test

Embodiment 1

[0020] See figure 1 The heat dissipation and circuit insulation device for high-power LED lamps in this embodiment includes: a heat conduction plate 1, and a plurality of bar-shaped grooves 2 provided on the front side of the heat conduction plate 1 for setting power supply circuit slats.

[0021] The high-power LED lamp of this embodiment has a plurality of parallel light-emitting strips, and the strip grooves 2 form a light-emitting strip in two ways:

[0022] The first type: a pair of bar-shaped grooves 2 are arranged adjacent to each other in parallel, and the mesa between the pair of bar-shaped grooves 2 is a bonding surface 5, and the light-emitting parts 4 of the large-power LED chips on the same light-emitting strip are bonded to the bonding surface. On the joint surface 5, and the positive and negative poles of the large power LED chips are connected in series or in parallel through the power supply circuit slats arranged in the pair of strip grooves 2.

[0023] The ...

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Abstract

The invention relates to a heat dissipation and circuit insulating device of a high-power light emitting diode (LED) lamp. The device comprises a heat conducting plate, and a plurality of strip grooves formed on the front lateral surface of the heat conducting plate and used for arranging power supply circuit board strips; the luminous part of each high-power LED chip in the LED lamp on the heat conducting plate is jointed to a joint face at one side of the strip groove, a heat conducting tube formed at one time together with the heat conducting plate is arranged opposite to the joint face on the rear lateral surface of the heat conducting plate, and each heat conducting tube is connected with a cooling system; and anodes and cathodes of the high-power LED chips are connected in series or in parallel through the power supply circuit board strips. The power supply part and the luminous part of the high-power LED are separately produced and then nearly jointed on the same plane. Therefore, insulation of a high-current circuit is fully protected, and isolation-free heat dissipation of a luminous body is met. The power supply circuit part of the LED has more reliable safe insulation performance, and the heat dissipation part of the LED has better heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to a heat dissipation and circuit insulation device for high-power LED lamps. Background technique [0002] At present, the energy saving of LED products is widely recognized. However, there are two main obstacles restricting its development and mass use; one is high cost; the other is serious light attenuation. The main reason for the serious light decay is heat dissipation. When high-power LEDs work, the power supply current is large, so a thicker insulating layer is required when installing high-power LEDs. An overly thick insulating layer is not good for heat dissipation, which is a contradiction. [0003] How to reduce both cost and light attenuation is a technical problem to be solved in this field. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a cooling and circuit insulation device for high-power LED lamp...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21V19/00F21V23/06F21Y101/02F21V29/51
Inventor 庄大东
Owner CHANGZHOU XINHUA ELECTRONICS
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