Heat radiating module and electronic device using same

A technology for heat dissipation modules and electronic devices, which is applied in the directions of circuits, electrical components, electric solid devices, etc., can solve the problems of reduction and the heat dissipation performance of the heat dissipation module is not as expected, and achieve the effect of reducing the case temperature.

Inactive Publication Date: 2011-11-23
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it should be noted that, in such a heat dissipation module that utilizes the heat dissipation fins 14 with the concave surface 18 to achieve heat dissipation, the area of ​​the heat dissipation fins 14 blown by the airflow provided by the fan 12 will be reduced simultaneously, so that the heat dissipation module Thermal performance is not as expected

Method used

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  • Heat radiating module and electronic device using same
  • Heat radiating module and electronic device using same
  • Heat radiating module and electronic device using same

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Embodiment Construction

[0031] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0032] According to an embodiment of the present invention, please refer to image 3 , a heat dissipation module 100 can be applied to an electronic device 200 . The electronic device 200 has a casing 202 and at least one heat source. The following is the heat dissipation module 100 according to a preferred embodiment of the present invention. The first heat source 204 and the second heat source 206 are described as two heat sources, but the number of heat sources is not limited thereto.

[0033] According to an embodiment of the present invention, the electronic device 200 includes a casing 202 , a first heat source 204 and a second heat source 206 . Wherein the first heat source 204 and the second heat source 206 are located in the casing 202 .

[0034] For example, the electronic device 200 can be a notebook computer, an...

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Abstract

The invention discloses a heat radiating module applied to an electronic device. The electronic device comprises a housing and at least one heat source. The heat radiating module comprises a heat pipe, a first heat radiating fin set, a second heat radiating fin set and a fan. By means of the heat pipe, the heat generated by the heat source can be transmitted to the heat pipe for performing heat radiation via the heat radiating fin sets. The air flow provided by the fan can directly blow to the housing via a ventilating passage which is formed by the housing and a bent part, so that the temperature of the housing of the electronic device can be reduced effectively.

Description

technical field [0001] The invention relates to a heat dissipation module and an electronic device with the heat dissipation module, in particular to a heat dissipation module whose fan has a bending part and an electronic device with the heat dissipation module. Background technique [0002] In recent years, with the rapid development of semiconductor technology, the size of the process has been gradually reduced, making the number of electronic components per unit area grow exponentially, and the calculation speed of electronic components inside computer equipment is also constantly increasing. Therefore, the electric power consumption of each electronic component is constantly increasing and accompanied by the generation of excessive heat energy. In order to avoid the operation hysteresis caused by overheating of electronic components, and even temporary or permanent damage and failure, generally speaking, a heat dissipation module is added to the electronic device (such ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/34
Inventor 王锋谷杨智凯洪国泰郑羽志杨皓文
Owner INVENTEC CORP
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