Solar silicon wafer suction pen

A technology of solar silicon wafers and absorption parts, applied in the field of tools, can solve problems such as low operating efficiency, low operating efficiency, and surface damage of silicon wafers, and achieve the effects of simple operating methods, high operating efficiency, and surface structure protection
CN102259762AInactive Publication Date: 2011-11-30SOPRAY ENERGY

Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
SOPRAY ENERGY
Publication Date
2011-11-30
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates to a suction pen for solar silicon wafers, which is made of glass material. The structure includes a suction part and a grip part. The suction part is connected to one end of the grip part. The connecting head is connected, the suction part is plate-shaped, a sinkhole is provided on the front of the suction part, the grip part is connected to the back of the suction part, a through hole is arranged inside the grip part along its axial direction, and a sinkhole is set on the bottom surface of the sinkhole. There is an air hole, and the air hole communicates with the through hole in the grip part; a through hole connecting the outside world and the through hole is provided at the middle position of the grip part. The solar silicon chip is conveniently picked up by the suction pen, which can effectively reduce the fragmentation rate of the silicon chip and reduce damage to the surface of the silicon chip.
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Description

technical field

[0001] The invention relates to a tool for picking up sheet objects, in particular to a suction pen for picking up solar silicon wafers. Background technique

[0002] As a clean energy source, solar energy is being widely used day by day. Silicon wafers are the most important components in the solar energy industry. Silicon wafers need to undergo multiple processing procedures in the production process to ensure the photoelectric conversion effect of silicon wafers. In the production process of silicon wafers, it is necessary to carry out the loading operation of scattered silicon wafers, and load the silicon wafers on the support so that the surface of the silicon wafers can be treated intensively. There are two main methods of loading silicon wafers at present, one is to use non-metallic (such as bamboo chips) to pick them up, and the other is to use hands when the operator wears gloves. take. When the silicon wafer is clamped with a snapper, it is easy ...

Claims

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