LED device manufacturing method
A technology of LED devices and manufacturing methods, which is applied in the direction of semiconductor devices, electric solid devices, electrical components, etc., can solve problems such as productivity decline, fluorescent substance powder precipitation, and deterioration of light characteristics, so as to reduce production costs and improve operation speed , the effect of reducing the amount of usage
Inactive Publication Date: 2011-11-30
PROTEC CO LTD
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Problems solved by technology
[0006] Fluorescent substances mixed and coated in silica gel solutions are very expensive
However, if figure 1 As shown, if the cavity of the package 1 is filled with the fluorescent liquid 3, the consumption of the fluorescent material will increase, which will cause the increase in the production unit price of the LED device.
Moreover, during the curing process of the silica gel solution, the precipitation of fluorescent substance powder may occur, and the problem of uneven distribution of fluorescent substance may occur
If the distribution of the fluorescent substance coated on the LED chip 2 is not uniform, the characteristics of the light irradiated to the outside of the LED device will deteriorate, and the chromaticity of the light will also be inconsistent, which will cause a decrease in the quality of the entire LED device manufacturing process.
[0007] In addition, in order to uniformly apply the fluorescent substance, a method of applying the fluorescent liquid 3 while moving the nozzle into the cavity of the package 1 is adopted, but this method of applying while moving the nozzle requires a certain amount of work time, Problems that reduce overall productivity
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[0024] Hereinafter, the first to third embodiments of the LED device manufacturing method of the present invention will be described with reference to the drawings.
[0025] Figure 2 to Figure 4 It is a schematic diagram for explaining the first embodiment of the LED device manufacturing method of the present invention.
[0026] First, prepare as figure 2 Package 10 of the form shown. There is a recessed portion 101 with a recessed bottom surface, and the LED chip 11 is bonded and placed in the recessed portion 101 . The LED chip 11 is connected to the electrodes of the package 10 by wires 12 .
[0027] In this state, a fluorescent substance is applied to the LED chip 11 attached to the package 10 to form the fluorescent portion 13 (step (a)). At this time, the fluorescent substance is not mixed with the synthetic resin solution, but a powdery fluorescent substance (phosphor powder) is used. That is, a certain amount of phosphor powder is coated (sprayed) on the LED chi...
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The invention provides a method for manufacturing an LED device. While reducing the amount of fluorescent material used, the fluorescent material coated on the LED chip is evenly distributed to manufacture an LED device with excellent luminous characteristics. The LED device manufacturing method of the present invention includes: step (a), coating fluorescent substance on the above-mentioned LED chip attached to the package to form a fluorescent part; step (b), applying vibration to the above-mentioned package to make the above-mentioned LED chip The coated fluorescent substance spreads and covers evenly. The manufacturing method of the LED device of the invention has the effects of reducing the amount of fluorescent material required for coating the LED chip and reducing the manufacturing cost of the LED device. Moreover, the manufacturing method of the LED device of the present invention has the effect of adjusting the distribution of the fluorescent substance coated on the LED chip and improving the light characteristics of the light emitted by the LED device. In addition, the LED device manufacturing method of the present invention also has the effect of increasing the working speed of coating the fluorescent substance on the LED chip.
Description
technical field [0001] The invention relates to a method for manufacturing an LED device, in particular to a method for improving the process of coating a fluorescent substance on a package attached with an LED chip and manufacturing a high-efficiency LED device. Background technique [0002] Generally speaking, LED chips usually emit blue or red light. If the LED chip is coated with a fluorescent liquid mixed with silica gel and fluorescent substances, the color of the LED device will change according to the amount of fluorescent substances. [0003] For example, an LED chip that emits blue light, when the light it emits passes through the fluorescent liquid, the light that does not conflict with the fluorescent substance remains blue. On the other hand, the light that collides with the fluorescent substance particles contained in the fluorescent liquid emits yellow light with a shorter wavelength as secondary light. In this way, blue light maintaining the color of the pr...
Claims
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IPC IPC(8): H01L33/48H01L33/50
CPCH01L2224/8592H01L2924/181H01L2224/45139H01L2224/48091H01L2924/00014H01L2924/00011H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207H01L2924/01049
Inventor 洪承珉李秀镇
Owner PROTEC CO LTD