Method for detecting adhesiveness of film based on surface wave

Abstract

The invention belongs to the technical field of film nondestructive detection, and relates to a method for detecting the adhesiveness of a film based on a surface wave. The method comprises the following steps of: constructing a spring hypothetical model representing the adhesive characteristic of a film; establishing a particle displacement expression of the surface wave; substituting a boundary condition of the surface wave spread in a film / base structure into the surface wave particle displacement expression so as to obtain an equation group composed of 6 equations, namely B6*6C6*1=0; causing determinant of a coefficient matrix B6*6 to be zero, and taking KN and KT as parameters influencing a chromatic dispersion curve, so as to obtain the chromatic dispersion curve of the surface wave; exciting the surface wave on the surface of a sample sheet to be detected; collecting surface wave signals from two different positions close to the surface of the sample sheet to be detected; analyzing and processing the surface wave signals, so as to obtain an experimental chromatic dispersion curve of the surface wave; matching the curve with the obtained surface wave dispersion curve, so as to obtain a normal elastic coefficient KN on the surface of the sample sheet to be detected; and determining the adhesiveness between the thin film and the base according to the KN. The detection method provided by the invention can be used for fast and accurately detecting the adhesiveness between the film and the base without loss.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing of thin films, and relates to a method for detecting adhesion between a thin film and a base material. Background technique [0002] The adhesion between film and substrate is an important mechanical characteristic of film materials, which seriously affects the quality and life of products. Therefore, it is necessary to develop related detection technologies to characterize film adhesion. For the characterization of film adhesion, there are usually many methods such as tape sticking method, scratch method, etc., which are diverse and complex. Tape sticking and peeling method uses a special tape to stick on the surface of the film, lifts the tape at a certain angle and speed, and observes the situation of the film being lifted by the tape, so as to judge the adhesion between the film and the substrate. This method is a destructive testing technique and can only respond qualitativel...

AI Technical Summary

Problems solved by technology

This technique also causes damage to the film, and is affected by factors such as scratch rate, loading rate, and film surface roughness, so it can only semi-quantitatively characterize the adhesion of the film

None of the above methods can achieve quantitative and non-destructive characterization of film adhesion, so a new technology that can quickly, accurately and non-destructively characterize the film-substrate adhesion is needed

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