Ultra-thin-type LED (light emitting diode) support with heat-radiation bottom

Abstract

The invention discloses an ultra-thin-type LED (light emitting diode) support with a heat-radiation bottom. The support comprises a support body and an electrode pin which is connected to the support body and extends outward, wherein a reflection cup is arranged on the support body; the electrode pin comprises a connecting part extending into the support body and a free part extending out of the support body; the front surface of the electrode pin extends into the reflection cup and is exposed on the bottom surface of the reflection cup, and a plurality of die bonding parts for mounting chips are formed; and a rear part which is directly communicated with the support body via the back surface is used as a heat radiation substrate of the chips. Compared with the traditional bent support, the heat conduction quantity of the support provided by the invention is higher than that of the traditional bent support by 60%; the silica gel quantity required for packaging the novel support is only 1.60 cubic millimeters; and the novel support can contain three chips of 10*23MIL, so that about six times of luminous flux is improved.

Description

technical field [0001] The invention relates to an ultra-thin LED bracket with bottom heat dissipation. Background technique [0002] LED is a semiconductor light-emitting device, which is widely used as indicator light, display screen and so on. LED has changed the principle of tungsten filament luminescence of incandescent lamps and three-based toner luminescence of fluorescent lamps. It uses electric field luminescence and has the advantages of high luminous efficiency, no radiation, long life, low power consumption and environmental protection. With the continuous expansion of LED applications, the requirements for the luminous efficiency and heat dissipation efficiency of LED packages are getting higher and higher, and these are also the most important parameters at the beginning of the design of LED brackets. In the prior art, for example, the invention title of application number 201010594373.8 is a patent for invention of LED and LED bracket, as attached image 3 As...

AI Technical Summary

Problems solved by technology

In the prior art, for example, the invention title of application number 201010594373.8 is a patent for invention of LED and LED bracket, as attached image 3 As shown, an LED bracket is disclosed: it includes a bracket body made of resin colloid and a conductive terminal connected to the bracket body and extending outward. The bracket body is provided with a receiving cavity, and the conductive terminal includes A connecting part extending into the main body of the bracket and a free part extending out of the soil of the bracket, the connecting part of the conductive terminal protrudes into the aforementioned accommodating cavity and is exposed on the bottom surface of the accommodating cavity, and these connecting parts have A plurality of crystal-bonding parts for placing LED chips, the free part of the conductive terminal is bent toward the bottom surface of the main body of the bracket to form a bent part, the overall height of this type of LED bracket is relatively large, and the heat dissipation is not good

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