Double discharge orifice notching radiating fin provided with fixed slideway

Abstract

The invention discloses a double discharge orifice notching radiating fin provided with a fixed slideway. The radiating fin comprises a radiating fin body which comprises a fixed plane, a first heat radiation surface, a connection surface and a second heat radiation surface which form a stepped structure in one body. The fixed plane is provided with a fixed slideway. The first heat radiation surface is provided with two rows of screw holes which have different heights and are used for fixing electronic components. The double discharge orifice notching radiating fin is mainly used for carrying out auxiliary heat radiation on a circuit board, by utilizing a stepped characteristic of the radiating fin, a heat radiation area is large, and heat radiation effect is enhanced. The fixed slideway on the fixed plane enables agility and convenience of the fixed plane in an actual installation operation. The screw holes with different heights on the first heat radiation surface can satisfy assembling demands of the electronic components in different specifications and dimensions simultaneously. The radiating fin body is the one body structure and has the characteristics of simple structure, strong structure adaptability, good stability and good heat radiation effect.

Description

technical field [0001] The invention belongs to the field of heat dissipation of circuit boards, in particular to a stepped heat sink with double rows of holes provided with fixed slideways. Background technique [0002] Due to the integration of a large number of electronic components on the circuit board, a large amount of heat will be released during operation, causing the temperature of the circuit board to rise. If the temperature in a local area is too high, it will affect the working stability of the electronic components. Therefore, it is necessary to improve the heat dissipation effect of the circuit board and reduce the working temperature. temperature, to ensure its stability and prolong its service life. [0003] A common heat dissipation method is to install a heat sink on the circuit board, quickly absorb the heat of the circuit board through the heat sink, and transfer the heat out through its heat dissipation surface, so as to achieve the cooling effect. The...

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Problems solved by technology

The traditional way of fixing the heat sink is usually to use silica gel to adhere to the surface of the circuit board, or to use screws to fix it on the surface of the circuit board or other predetermined points. Using a heat sink adhered to silica gel, after a period of use, the silica gel will change. If the heat sink is dry and the adhesion is reduced, the heat sink cannot be well connected with the circuit board. For the heat sink fixed by screws, the screw holes on the heat sink must correspond to the predetermined points one by one, otherwise errors will occur and the installation operation will be damaged. Unnecessary troubles are caused. Such heat sinks are too targeted and have poor structural adaptability. In addition, in the connection between electronic components and heat sinks, there will be one or a row of screw holes on the traditional heat sink for electronic components. Connection, but because the specifications of each electronic component are different, the height of the installation on the heat sink is also different, one or a row of screw holes is difficult to meet the needs of electronic components of different specifications

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