Micromachine thermopile infrared sensor with high duty cycle and manufacture method thereof

A technology of infrared detector and thermopile, which is applied in the direction of electric radiation detector, piezoelectric device/electrostrictive device, piezoelectric/electrostrictive/magnetostrictive device, etc. Effective improvement, small area and other issues

Active Publication Date: 2012-01-18
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the area of ​​the absorption region in the middle of the circular structure thermopile infrared detector is small, so that the logarithm of the detector thermocouple cannot be effectively improved

Method used

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  • Micromachine thermopile infrared sensor with high duty cycle and manufacture method thereof
  • Micromachine thermopile infrared sensor with high duty cycle and manufacture method thereof
  • Micromachine thermopile infrared sensor with high duty cycle and manufacture method thereof

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Experimental program
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Effect test

Embodiment 1

[0038] The thermocouple material is polysilicon and aluminum, and the heater material is polysilicon.

[0039] (1) Silicon oxide is thermally grown on the front surface of the polished silicon wafer (13), and then a layer of polysilicon (15) is deposited on the silicon oxide film by LPCVD.

[0040] (2) Doping the polysilicon film to make it conductive. Photoetching patterns and etching to form polysilicon strips. The polysilicon (15) in the thermocouple area is used as a component of the thermocouple. The structure of the polysilicon thermocouple arm is as Image 6 As shown, the thermocouple arm is folded.

[0041] (3) Use LPCVD or PECVD to deposit a layer of silicon oxide (18) as an insulating layer. Photoetch the lead hole pattern to remove the silicon oxide in the lead hole area. see Figure 7-1 .

[0042] (4) Deposit a layer of metal thin film aluminum by evaporator or sputtering apparatus. The metal lines are lithographically etched and the metal is corroded. Part of the metal...

Embodiment 2

[0047] The specific implementation steps are partly the same as those in Embodiment 1, and the main difference is: First, the channel process released by the thermopile structure in step (6) of Embodiment 1 is removed. Second, the silicon substrate is completely radiated from the back side to release the thermopile structure. Third, a layer of black body material for enhancing infrared absorption is deposited in the thermopile absorption area. The device geometry is such as Figure 8 Shown.

Embodiment 3

[0049] The specific implementation steps are partly the same as those in Embodiment 1, the main difference is that the folding of the thermocouple structure is changed from two folding to three equal-length folding, thereby further improving the duty cycle. The layout structure of the thermopile device is as follows Picture 9 Shown.

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Abstract

The invention relates to a micromachine thermopile infrared sensor with high a duty cycle and a manufacture method thereof. The micromachine thermopile infrared sensor is characterized in that L-shaped foldable thermocouple arm design is adopted; the straight structure of the traditional thermopile is abandoned, the thermocouple arms are folded, and the folded thermocouple arms are mutually vertical. A thermocouple structure cold junction zone (21) is fixed on a silicon substrate (13); a thermopile structure hot junction zone end (20) is fixed on an infrared absorption zone (15); a silicon substrate (16) below the thermopile structure is removed by the silicon corrosion technology; and the thermocouple arms (14 and 12) of the thermopile sensor are distributed around the adsorption zone in a folded mode. The micromachine thermopile structure can be widely applied to micro electro mechanical sensors, such as infrared detectors, gas sensors, vacuum sensors and the like.

Description

Technical field [0001] The invention relates to a micro-mechanical thermopile micro-infrared detector with a high duty cycle and a manufacturing method, belonging to the technical field of micro-electronic mechanical systems and micro-processing. Background technique [0002] With the development of Micro Electro Mechanical systems (MEMS) technology, micromechanical thermopile infrared detectors have also been widely used. Compared with traditional infrared detectors, micro-mechanical thermopile infrared detectors have the advantages of no need for cooling, low power consumption, high integration, and suitable for mass manufacturing. Micro-mechanical thermopile infrared detectors are now widely used in national defense and civil applications. field. [0003] figure 1 The structure principle diagram and cross-sectional schematic diagram of the traditional micromechanical thermopile infrared sensor are given. The whole detector includes five parts: (silicon) substrate, thermopile, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/12G01J5/14B81B3/00B81C1/00
Inventor 熊斌徐德辉马颖蕾王跃林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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