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Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof

A high thermal conductivity, silicone technology, applied in chemical instruments and methods, adhesives, adhesive additives, etc., can solve the problems of lack of fluidity, incapable of electronic potting, etc., to make up for low thermal conductivity, excellent fluidity, The effect of improving mechanical properties

Active Publication Date: 2013-03-20
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese invention patent 200810219101.2 discloses a heat-conducting and flame-retardant liquid silicone rubber for electronics, although it has a high thermal conductivity (thermal conductivity: 1.5-2.5W m -1 ·K -1 ) and flame retardant properties, but because of its viscosity above 20Pa s, it lacks good flow properties and cannot be used as an electronic potting compound

Method used

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  • Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 100 parts by mass of linear vinyl siloxane with a viscosity of 200 mPa·s and a vinyl content of 0.8 wt%, 425 parts by mass of 50 μm spherical aluminum oxide, 45 parts by mass of 0.1 μm boron nitride, and a diameter of 30 parts by mass of 2.5μm silicon carbide whiskers with an aspect ratio of 20 are added to a vacuum kneader, at a temperature of 120°C, a vacuum degree of 0.08MPa, dehydrated and blended for 120 minutes, then grind 3 times with a three-roll machine to obtain a base material .

[0029] 11.9 parts by mass of hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.1%, an appropriate amount of crosslinking inhibitor and 100 parts by mass of base material were thoroughly stirred and mixed for 20 minutes to obtain component A. An appropriate amount of platinum catalyst and 100 parts by mass of the base material were stirred and mixed under a mixer for 20 minutes to obtain component B.

[0030] Take equal parts of component A and component B ...

Embodiment 2

[0032] 80 parts by mass of linear vinyl siloxane with a viscosity of 1000 mPa·s and a vinyl content of 0.3 wt%, and a branched vinyl siloxane with a viscosity of 450 mPa·s and a vinyl content of 3.0 wt% 20 Parts by mass, 100 parts by mass of 1 μm spherical aluminum oxide, 20 parts by mass of 50 μm spherical aluminum oxide, 76 parts by mass of 5 μm boron nitride, silicon carbide whiskers with a diameter of 0.05 μm and an aspect ratio of 10 4 The mass parts are added to a vacuum kneader, the temperature is 120° C., the vacuum degree is 0.08 MPa, and after dehydration and blending for 120 minutes, the base material is obtained by grinding 3 times with a three-roll machine.

[0033] 7.5 parts by mass of a hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.3%, an appropriate amount of crosslinking inhibitor and 100 parts by mass of the base material are thoroughly stirred and mixed for 20 minutes to obtain component A. An appropriate amount of platinum ca...

Embodiment 3

[0036] 100 parts by mass of linear vinyl siloxane with a viscosity of 500 mPa·s and a vinyl content of 0.45 wt%, 160 parts by mass of 5 μm spherical aluminum oxide, 30 parts by mass of 2 μm boron nitride, and a diameter of 0.5 10 parts by mass of silicon carbide whiskers with a μm and an aspect ratio of 40 were added to a vacuum kneader at a temperature of 120° C. and a vacuum degree of 0.08 MPa. After dehydration and blending for 120 minutes, the base material was obtained by grinding 3 times with a three-roller.

[0037] 8.2 parts by mass of a hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.22%, an appropriate amount of crosslinking inhibitor and 100 parts by mass of the base material were thoroughly stirred and mixed for 20 minutes to obtain component A. An appropriate amount of platinum catalyst and 100 parts by weight of base material were stirred and mixed under a mixer for 20 minutes to obtain component B.

[0038] Take equal parts of compone...

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Abstract

The invention discloses an additive high-thermal-conductivity organic silicon electronic pouring sealant and a preparation method thereof. The preparation method comprises the following steps of: adding vinyl-ended polydimethylsiloxane, spherical aluminum oxide, boron nitride and silicon carbide whiskers into a kneader, dehydrating and blending at the temperature of 100-150 DEG C and under the vacuum degree of 0.06-0.1MPa, cooling, and grinding for three times to obtain a substrate; adding a hydrogen-containing silicon oil crosslinking agent and a crosslinking inhibitor into the substrate at normal temperature, and fully stirring to prepare a component A; adding a platinum catalyst into the substrate, and fully stirring to prepare a component B; and uniformly blending the component A and the component B having equal part by weight, and defoaming under the vacuum degree of 0.06-0.1MPa to obtain the additive high-thermal-conductivity organic silicon electronic pouring sealant. The pouring sealant has high flowability and thermal conductivity of higher than 1.0 W.m<-1>.K<-1>, and can be widely applied to the fields of electronic apparatuses, automobiles, chip encapsulation, LED (Light-Emitting Diode) encapsulation and the like having high requirements on heat conducting performance; and a condensate has high mechanical property and high electrical property.

Description

Technical field [0001] The invention relates to the technical field of electronic potting materials, in particular to organic silicon electronic potting glue and its preparation technology. Background technique [0002] Addition type silicone rubber generally uses vinyl-containing polydimethylsiloxane as the base polymer and hydrogen-containing silicone oil as the cross-linking agent. Under the action of a platinum-based catalyst, it is cross-linked into an elastomer through the hydrosilylation reaction. Compared with condensed silicone rubber, addition type silicone rubber has no low-molecular by-products during the vulcanization process, minimal shrinkage, deep vulcanization, no corrosion, easy control of cross-linking structure, and vulcanized products can be vulcanized at room temperature and It can be heated and vulcanized, and it is recognized as the preferred material for electronic potting at home and abroad. But typical unfilled silicone rubber has poor thermal conducti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K7/10C08K3/22C08K3/38C09J183/07C09J183/05C09J11/04C09K3/10
Inventor 陈精华曾幸荣胡新嵩林晓丹李国一李豫黄德裕罗伟
Owner SOUTH CHINA UNIV OF TECH
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