Chip component mounting structure, chip component mounting method and liquid crystal display device

Abstract

Provided are a chip component mounting structure and a chip component mounting method, wherein when a plurality of chip components having different heights are mounted on a substrate via an anisotropic conductive film, position gaps which occur when the chip components are pressure-bonded to the substrate are prevented, and the chip components can be accurately mounted to the substrate at target positions; and a liquid crystal display device provided with the substrate. In the chip component mounting structure, a position fixing resin (4) for maintaining the orientation of chip components (2) which are pressure-bonded to a substrate (1) via an anisotropic conductive film (7) is provided. In the chip component mounting method, after the position fixing resin (4) for maintaining the orientation of the chip components (2) which are mounted to the substrate (1) via the anisotropic conductive film (7) is applied to the substrate (1) and cured, the chip components (2) are heated at a predetermined temperature and pressed at a predetermined pressure via an elastic sheet (5) provided on the chip components (2) and, then, pressure-bond to the substrate (1) together. The liquid crystal display is provided with such a substrate.

Description

technical field [0001] The present invention relates to a chip component mounting structure, a chip component mounting method, and a liquid crystal display device, and more particularly, to a chip component mounting structure suitable for collectively mounting a plurality of chip components with different heights on a substrate, a chip component mounting method, and a device provided with the substrate. Liquid crystal display device. Background technique [0002] Conventionally, a mounting method has been performed in which chip components (ICs, resistors, capacitors, etc.) are collectively pressure-bonded on liquid crystal modules, glass substrates, or plastic substrates using adhesive materials such as anisotropic conductive films. [0003] Anisotropic conductive film (also called ACF) is a polymer film in which conductive particles (solder, resin balls are plated, etc.) are dispersed, and it has adhesiveness, conductivity and insulation. A connecting material with three ...

AI Technical Summary

Problems solved by technology

[0007] Even if the performance of the mounted chip components is good, if they are not correctly mounted on the substrate, it will not become a product (liquid crystal display device) that exhibits the specified performance, and the stability of product quality cannot be achieved, and it will become a defective product

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