Capacitor structure and manufacturing method thereof

Abstract

The invention discloses a capacitor structure and a manufacturing method thereof. The capacitor structure comprises at least one solid capacitor substrate and two support plates, wherein the solid capacitor substrate is accommodated at the opposite inner sides of the two support plates, and is provided with an anode conductor and a cathode conductor which is electrically connected with metal line layers at the inner sides of the support plates, whereas, an insulating base body is solidified between the solid capacitor substrate and the interiors of the two support plates by utilizing an insulating resin sealing compound; and moreover, arc slots for the anode conductor and the metal line layers to expose are respectively and longitudinally formed on the two vertical side planes of the insulating base body by utilizing mechanical processing; an anode conductive terminal and a cathode conductive terminal which cover to the end part of the anode conductor and the metal line layers and are electrically connected are respectively formed at the positions of the arc slots at both sides of the insulating base body and the surfaces of the support plates after conductive metal is immersed to deposit; and then, cutting is carried out to separate out all single capacitor finished products, thereby, the manufacturing method for the capacitors is completed.

Description

Technical field [0001] The invention provides a capacitor structure and a manufacturing method thereof, in particular, it can be clamped on the upper and lower layers of a solid capacitor substrate by using two carrier plates to improve the pull-out resistance during dressing, and can penetrate the concave arc shape in the electrode terminal The structure design increases the area of ​​the solder collecting tin attachment area, so that the electrode terminal part is hidden in the arc groove, and protects the electrical contact effect between the electrode terminal and the solid capacitor substrate. Background technique [0002] Today electronic products and their peripheral related electronic devices use active and passive components. Among them, active components (such as microprocessors or chips) can perform calculations and processing functions independently, while passive components are in contrast to active components. When the current or voltage is changed, the resistance o...

AI Technical Summary

Problems solved by technology

[0011] The main purpose of the present invention is to improve the pull-out resistance of the capacitor when it is mounted by surface mount technology (SMT) by utilizing the board bending characteristics of the glass fiber board to clamp the upper and lower layers of the solid capacitor substrate. , and has better structural stability, and can control the shrinkage stress generated by the insulating resin sealant filling during curing, and improve the board bending caused by the use of a single carrier board in the overall large-area sealant curing process

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