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Double-scanning three-dimensional (3D) laser etching method based on controllable profile shape and power distribution of light beams

A cross-sectional shape, three-dimensional laser technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems that cannot become industrial technology, and achieve the effect of improving processing accuracy

Active Publication Date: 2015-05-13
中国航天科技集团公司第五研究院第五一0研究所
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  • Abstract
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  • Application Information

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Problems solved by technology

Therefore, it cannot become a practical industrial technology

Method used

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  • Double-scanning three-dimensional (3D) laser etching method based on controllable profile shape and power distribution of light beams

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Embodiment Construction

[0014] The dual-scan three-dimensional laser etching processing method of the present invention will be further described below through specific examples.

[0015] refer to figure 1 First, the orthogonal acousto-optic scanning deflector 2 is placed orthogonally at the output port of the laser 1 . Set the target laser spot area to 0.2mm 2 of triangular spots. Adjust the excitation waveform of the X and Y direction acousto-optic deflectors (the required waveform is generated by an external waveform generator) and the power of the laser beam to 15W, so that the laser beam can be scanned at a small angle and high frequency to obtain an area of ​​0.2mm 2 , a triangular equivalent laser spot with a power of 15W and a uniform distribution of power. Then use the equivalent laser spot as the processing spot, use the laser scanning galvanometer system 3 arranged behind the acousto-optic deflector to control the moving track of the processing spot, and first scan and etch the initial ...

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Abstract

The invention provides a double-scanning three-dimensional (3D) laser etching method based on controllable cross-section shape and power distribution of light beams, and belongs to the technical field of laser etching. In the method, equivalent laser processing spots with controllable power profile distribution is matched with an optical machine scanning galvanometer so as to carry out double-scanning laser processing on the surface of a workpiece, which can realize the laser etching of a complex 3D microstructure. The double-scanning 3D laser etching method provided by the invention has the beneficial effects of promoting the capability of the existing laser etching technology from a two-dimensional (2D) plane laser etching mode to a 3D any-curve uncovered laser etching mode, and solving the problem of no appropriate processing technology of the 3D microstructure within the size range of 1mu m-1mm, thus having scientific and industrially practical potential.

Description

technical field [0001] The invention belongs to the technical field of laser etching processing, and relates to a laser etching processing method of a three-dimensional complex structure based on a new principle, in particular to a double-scanning three-dimensional laser etching processing method based on controllable beam cross-sectional shape and power distribution . Background technique [0002] Laser etching refers to the technology of using laser to ablate and remove the surface material of the workpiece. Compared with the relatively mature laser cutting and laser welding, it belongs to a new field of laser processing. It is a surface that has gradually developed with the advancement of high-peak ultrashort pulse laser (nanosecond, picosecond, femtosecond) technology in the past ten years. One of the earliest applications of structural micromachining technology is laser marking. In this technique, a focused laser beam is scanned across the surface to etch characters a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/362
Inventor 陈学康吴敢王瑞杨建平曹生珠韦波
Owner 中国航天科技集团公司第五研究院第五一0研究所