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Packaging structure and method thereof, and electronic equipment

A packaging structure and technology for electronic equipment, applied in the field of electronics, can solve problems such as limiting the internal circuit of the package, and achieve the effect of reducing electromagnetic interference and increasing functional performance.

Inactive Publication Date: 2012-02-29
HUAWEI DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a packaging structure, method, and electronic equipment to solve the technical problem that the existing packaging structure and packaging method can only form a full-coverage shield, which limits the function of the internal circuit of the package.

Method used

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  • Packaging structure and method thereof, and electronic equipment
  • Packaging structure and method thereof, and electronic equipment
  • Packaging structure and method thereof, and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] In view of the above-mentioned problems in the prior art, the embodiment of the present invention separates at least two circuit modules by connecting (preferably welding) shielding ribs on the substrate, and then laying a package insulator and a conductive coating, and passing the conductive coating Grounding the shielding ribs can form multiple isolated shielding parts inside the packaging structure, thereby forming multiple shielding areas and reducing electromagnetic interference between circuit modules inside the packaging structure.

[0033] Figure 2a A schematic top view cross-sectional view of the package structure provided in Embodiment 1 of the present invention, Figure 2b A schematic front view cross-sectional view of the package structure provided in Embodiment 1 of the present invention, as shown in Figure 2a and Figure 2b As shown, the package structure includes:

[0034] A substrate 21, on which a ground terminal 27 and at least two circuit modules...

Embodiment 2

[0045] Figure 3a A schematic top view cross-sectional view of the package structure provided by Embodiment 2 of the present invention, Figure 3b It is a front view cross-sectional schematic diagram of the package structure provided by Embodiment 2 of the present invention, Figure 3c A schematic side view cross-sectional view of the packaging structure provided for Embodiment 2 of the present invention, Embodiment 2 is in Figure 2a, on the basis of the first embodiment shown in 2b, taking the semiconductor circuit as an example, the first embodiment is expanded and formed, specifically: the shielding ribs in the embodiment of the present invention are preferably metal ribs, which have low resistance and conductivity Good advantage, wherein, the upper surface of the metal rib includes a plurality of protrusions, the protrusions are preferably sawtooth, but not limited to sawtooth, the longitudinal section of the sawtooth specifically includes triangle or arc shape, but not ...

Embodiment 3

[0053] In this embodiment, at least two circuit modules are separated by connecting shielding ribs on the substrate, and then laying a packaging insulator and a conductive coating, and grounding the shielding ribs through the conductive coating, so that multiple shielding ribs can be formed inside the packaging structure. area, reducing electromagnetic interference between circuit modules inside the package structure.

[0054] Figure 4 It is a schematic flowchart of the encapsulation method provided by Embodiment 3 of the present invention. Such as Figure 4 As shown, the method includes:

[0055] Step 401, connecting shielding ribs to the substrate including at least two circuit modules, so as to separate the at least two circuit modules;

[0056] Step 402, laying a packaging insulator on the substrate to cover the at least two circuit modules, the insulating packaging body being lower than the shielding rib;

[0057] Step 403 , laying a conductive coating on the insulat...

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Abstract

Embodiments of the invention disclose a packaging structure and a method thereof, and electronic equipment. The packaging structure comprises: a substrate (21), wherein a grounding terminal (27) and at least two circuit modules are arranged on the substrate (21); a shielding isolation rib (24), which is connected on the substrate (21) and is used to isolate the at least two circuit modules; a packaging insulator (25), which is laid on the substrate (21) so as to cover the at least two circuit modules and is lower than the shielding isolation rib (24); a conductive coating (26), which is connected with the grounding terminal (27) and is laid on the packaging insulator (25) so as to cover the packaging insulator (25) and the shielding isolation rib (24). In the embodiments of the invention, a plurality of shielding regions can be formed in the packaging structure; electromagnetic interference between the modules in the packaging structure can be reduced and simultaneously a function of the circuit in the packaging structure can be played well.

Description

technical field [0001] Embodiments of the present invention relate to electronic technology, and in particular to a packaging structure, method, and electronic equipment. Background technique [0002] Electromagnetic interference is a serious problem faced by most electronic equipment and circuit systems. Since electromagnetic interference often interrupts, hinders, and degrades the performance of electronic equipment or circuit systems, effective electromagnetic interference shielding is required to ensure the efficiency of electronic equipment or circuit systems and safe operation. [0003] Most of the existing packaging technologies use film technology or micro-connection technology, such as semiconductor packaging structure, to connect the semiconductor chip and the conductor part of the substrate so as to lead out the wiring pins, and potting and fixing them with plastic insulating medium, after that, use conductive coating Wrap the package and connect to the exposed "...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L23/12H01L21/50
CPCH01L23/3121H01L25/0655H01L2224/16225H01L2224/32225H01L2224/48227H01L2224/73204H01L2224/73265H01L2924/141H01L2924/1434H01L2924/157H01L2924/15788H01L2924/1579H01L2924/19107H01L2924/3025H01L24/73H01L2924/14H01L23/552H01L2924/00012H01L2924/00
Inventor 成英华孙睿王风平丁海幸
Owner HUAWEI DEVICE CO LTD