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Electronic device

A technology of electronic devices and heat dissipation devices, which is applied in the direction of TV, electrical components, electric digital data processing, etc., can solve problems such as not being able to meet heat dissipation requirements, and achieve good heat dissipation effects

Inactive Publication Date: 2012-03-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After canceling the fan, the natural convection heat dissipation method can only be completed through the conduction and radiation of the heat sink, and the air circulation speed in the natural convection method is far less than 1 m / s, so it is far from meeting the heat dissipation requirements

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] see figure 1 and figure 2 , A preferred embodiment of the electronic device of the present invention includes a casing 10 and a cover 30 installed in the casing 10 . In a preferred embodiment, the electronic device is an AIO (all-in-one).

[0021] The housing 10 includes a bottom wall 11 and a cover 13 covering the bottom wall 11 . A first heat dissipation device 20 and a main board 40 are installed in the bottom wall 11 . The first heat dissipation device 20 is located on one side of the main board 40, and includes a plurality of first heat dissipation fins 21 parallel to each other, and the distance between every two adjacent first heat dissipation fins 21 is between 5.3-5.7 mm. between. In a preferred embodiment, the optimum distance between each first cooling fin 21 is 5.5 mm. A CPU (Central Processing Unit) 41 is installed on the motherboard 40 , and four installation holes 43 are defined around the CPU 41 . The motherboard 40 can install a second cooling de...

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PUM

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Abstract

The invention relates to an electronic device, which comprises a shell. The shell comprises a bottom wall and a cover board covering on the bottom wall. A main board and a first heat radiating device are assembled in the bottom wall. A second heat radiating device for radiating the heat of a central processor is fixed on the main board. The second heat radiating device is connected with the first heat radiating device together through a heat pipe. The first heat radiating device comprises a plurality of first heat radiating fins for radiating heat. The cover board is provided with an air inlet and an air outlet. The distance between every two first heat radiating fins is 5.3-5.7 mm. An airflow entering the interior of the shell through the air inlet flows through the second heat radiating device and the first heat radiating fins and then flows out of the shell through the air outlet.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device with good heat dissipation. Background technique [0002] With the rapid development of computer technology, all-in-one computers are becoming more and more popular in the market, and their designs basically integrate electronic components such as motherboards, hard disks, and displays into one housing. In this way, the integration of the electronic components is very high. The power of the chip of the central processing unit is also multiplied, and the heat density rises sharply, so that the all-in-one machine will generate a large amount of heat during the long-time operation. [0003] In order to solve the above problems, generally, a cooling device and a fan cooperating with the cooling device are installed on the central processing unit. When working, the cooling device absorbs the heat generated by the central processing unit, and then uses the cold air absorbed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/16G06F1/1601G06F1/20G06F2200/1631H04N5/64
Inventor 朱小素李阳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD