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Double-side plastic packaging method of LGA (Land Grid Array)

A technology for plastic sealing molds and packages, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as poor contact of packages, affecting product yield, and open circuits.

Active Publication Date: 2012-04-04
SAMSUNG SEMICON CHINA RES & DEV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the application of fine-pitch products, due to the limitation of the area and spacing of the pads, it is easy to cause solder joint bridging after the solder paste collapses, resulting in defects such as short circuits and open circuits, which affect product yield.
In addition, if the printing height and printing volume of solder paste are reduced in order to avoid the above defects, it may not be able to cope with poor contact caused by package warping, and the small size of solder joints will also affect the reliability of the product

Method used

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  • Double-side plastic packaging method of LGA (Land Grid Array)
  • Double-side plastic packaging method of LGA (Land Grid Array)
  • Double-side plastic packaging method of LGA (Land Grid Array)

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Embodiment Construction

[0016] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, but those of ordinary skill in the art should understand that these embodiments are provided so that this disclosure will be thorough and complete and not intended to limit the scope of the present invention. The embodiments shown in the drawings are merely exemplary, and the invention should not be construed as being limited to these examples. In the drawings, the size and relative sizes of layers and regions are exaggerated for clarity.

[0017] figure 1 It is a cross-sectional view of placing a packaging substrate in a plastic packaging mold in a double-sided packaging method for an LGA according to an embodiment of the present invention. Figure 2A is true figure 1 The cross-sectional view of the plastic sealing mold in the figure after injection molding is completed. Figure 2B is true figure 1 The top view of the plastic sealing ...

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Abstract

The invention discloses a double-side plastic packaging method of an LGA (Land Grid Array), which comprises the following steps in sequence of: placing a packaging substrate with a cutting road into a plastic packaging mold; injecting molding compounds into the plastic packaging mold; and cutting the injection-molded packaging substrate into the single LGA along the cutting road, wherein the plastic packaging mold comprises an upper mold and a lower mold; a flow passage corresponding to the cutting road of the packaging substrate is arranged in the lower mold; and designs for forming mold plastic convex pieces are formed at four corners of the lower mold corresponding to contact array packaging pieces.

Description

technical field [0001] The invention relates to a double-sided plastic sealing method of a contact array package (LGA), more specifically, to a double-sided plastic sealing method for maintaining the height of the solder joints of the LGA. Background technique [0002] A traditional LGA package usually has a chip surrounded by a mold compound on one side of the package substrate, and exposed electrode pads on the other side. In the surface mount (SMT) process, solder paste is first printed on the pads on the printed circuit board (PCB), and then the LGA package is aligned and placed on the PCB. After reflow soldering, the solder paste melts and is compatible with An intermetallic compound is formed between the pads on both sides to form an electrical connection to complete the mounting. [0003] However, in the packaging process of the LGA, it is difficult to control the mounting height of the LGA. Especially in the process of reflow soldering, due to the melting and colla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56B29C45/26
Inventor 陈峥嵘
Owner SAMSUNG SEMICON CHINA RES & DEV
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