Method for raising frequency characteristic of common source operational amplifier

A source terminal and device technology, used in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as reducing the frequency response characteristics of common source operational amplifiers, improve frequency response characteristics, and reduce parasitic overlap. The effect of capacitors

Active Publication Date: 2012-04-11
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is a parasitic overlapping capacitance C between the output terminal and the input terminal of the common-source operational amplifier, that is, between the gate terminal and the drain terminal of the NMOS device 2 gd , which forms a feedback capacitor, therefore, due to the Miller effect, the parasitic overlap capacitance C gd will seriously degrade the frequency response characteristics of this common-source op amp

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for raising frequency characteristic of common source operational amplifier
  • Method for raising frequency characteristic of common source operational amplifier
  • Method for raising frequency characteristic of common source operational amplifier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will combine Figure 3A-Figure 4C The above-mentioned spirit and essence of the present invention are described in detail.

[0026] Figures 3A-3C Three steps in the process of fabricating an NMOS device in a common-source operational amplifier in the prior art are exemplarily shown.

[0027] Figure 3A A cross-sectional view of an NMOS device after sidewall deposition in the prior art is exemplarily shown. like Figure 3A As shown in , in the manufacturing process of NMOS devices in the prior art, in the first step, LDD (Lightly Doped Drain) structures 11 and 12, STI (Shallow Trench Isolation) structure 13 are first formed under the upper surface of the substrate 10 and 14 , and a gate 15 is formed above the upper surface of the substrate 10 . The LDD structures 11 and 12 are located on both sides below the gate 15 respectively, and are used to form a source terminal and a drain terminal and form an NMOS device together with the gate 15 . The STI st...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a method for raising a frequency characteristic of a common source operational amplifier. The method comprises the following steps: with regards to source electrode terminal upside, drain electrode terminal upside and grid upside, carrying out plasma spacer film deposition; carrying out etching on deposited spacer films corresponding to the source electrode terminal upside, the drain electrode terminal upside and the grid upside so as to expose a part which is corresponding to a first LDD structure of the drain electrode terminal and is used for forming the drain electrode terminal and a part which is corresponding to a second LDD structure of the source electrode terminal and is used for forming the source electrode terminal, wherein, a plasma etching direction and a normal direction on a substrate upper surface show a predetermined angle and is inclined to upside corresponding to the source electrode terminal, and after etching, thickness of a grid spacer corresponding to the drain electrode terminal upside is larger than thickness of a grid spacer corresponding to the source electrode terminal upside; respectively carrying out heavy doping and annealing process on the exposed parts of the first LDD structure and the second LDD structure to form heavily doped ion zones corresponding to the drain electrode terminal and the source electrode terminal.

Description

technical field [0001] The present application relates to the manufacture of semiconductor devices, more precisely, the present invention relates to a semiconductor device spacer etching method and semiconductor devices manufactured using the method. Background technique [0002] Complementary metal-oxide-semiconductor (CMOS) operational amplifiers are one of the building blocks of various circuits. With the development of information technology, the requirements for the processing speed of information data are getting higher and higher, and the requirements for the frequency response characteristics of the CMOS operational amplifiers used in it are also getting higher and higher. [0003] However, the parasitic capacitance of CMOS devices will produce more and more negative effects as the operating frequency increases. Therefore, how to reduce the influence of parasitic capacitance on CMOS operational amplifiers has become the key to improving the frequency response charact...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/336H01L21/311H01L29/78H01L29/423
Inventor 俞柳江
Owner SHANGHAI HUALI MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products