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Liquid photoreceptive solder resist ink

A photosensitive solder resist ink, liquid technology, applied in the direction of ink, optics, optomechanical equipment, etc., can solve the problems of sinking tin easy to lose oil, poor solder resist performance, poor chemical resistance, etc., to achieve high resolution, high waterproof , the effect of high insulation

Active Publication Date: 2012-04-18
江门市阪桥电子材料有限公司
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Problems solved by technology

[0003] The purpose of the present invention is to provide a liquid photosensitive solder resist ink and its production method, which solves the problems of poor chemical resistance of existing inks, easy oil loss of immersion gold and immersion tin, poor solder resistance performance, etc.

Method used

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  • Liquid photoreceptive solder resist ink

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Embodiment Construction

[0013] The liquid photosensitive solder resist ink according to the embodiment of the present invention is mainly composed of a main agent and a curing agent in a 3:1 combination.

[0014] The main agent is mainly composed of photosensitive resin, phthalocyanine green, melamine, photoinitiator, photosensitizer, dispersant, tetramethylbenzene, leveling agent, dibasic acid ester solvent, and barium sulfate.

[0015] The preparation method of the photosensitive resin is: adding 210 parts of o-cresol novolac epoxy resin (epoxy equivalent 210) into the reaction kettle, adding 100 parts of DBE (Oumod), and heating and dissolving. Next, add 0.1 part of the polymerization inhibitor p-hydroxyanisole and 1.5 parts of the catalyst triphenylphosphorus, heat the mixture to 95-105°C, slowly drip in 72 parts of acrylic acid, allow the reaction for 6 hours, and cool the reactant To 90℃, add 101 parts of tetrahydrophthalic anhydride, 110 parts of tetratoluene, 48 parts of DBE, keep at 90-95℃ and re...

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Abstract

The invention discloses liquid photoreceptive solder resist ink, which is mainly formed by combining a main agent and a curing agent according to the mass ratio of 3 / 1. The invention has the beneficial effects that: the double-component screen printing solder resist ink which is printed through double-component screen, is exposed through ultraviolet (UV) light, is developed through diluted alkaline has high resolution ratio; and the coatings after high temperature hardening is carried out have high insulativity, high solder resistance and high watertightness, and can be durable to immersion gold plating and immersion tin.

Description

Technical field [0001] The invention relates to the technical field of manufacturing precision circuit boards, in particular to a liquid photosensitive solder resist ink for manufacturing precision circuit boards. Background technique [0002] The original traditional screen printing solder resist ink cannot meet the requirements of fine circuit, poor chemical resistance, easy to lose oil when sinking gold and tin, and poor solder resist performance. Summary of the invention [0003] The purpose of the present invention is to provide a liquid photosensitive solder resist ink and a manufacturing method thereof, which solves the problems of poor chemical resistance of the existing inks, easy oil drop from the sinking gold and sinking tin, and poor solder resist performance. [0004] In order to achieve the above design objectives, the technical solutions adopted by the present invention are as follows: [0005] A liquid photosensitive solder resist ink, which is mainly composed of a ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/10G03F7/027G03F7/004C08G59/17C08G59/42C09D11/101C09D11/102
Inventor 李铨华
Owner 江门市阪桥电子材料有限公司
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