Holographic inversion detection method for micro-cracks on damaged layer of subsurface of brittle material

A technology for sub-surface damaged and brittle materials, applied in the field of material surface quality inspection, can solve the problems of staying, lack of quantitative characterization method of surface topography, unable to reflect the distribution characteristics of microcracks, etc., and achieve the effect of improving reconstruction accuracy.

Inactive Publication Date: 2012-04-25
XI AN JIAOTONG UNIV
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Problems solved by technology

However, due to the lack of quantitative characterization methods for the surface morphology after corrosion, it can only be used to estimate the depth information of the subsurface damage layer and observe the three-dimensional morphology characteristics of the microcracks after corrosion, and cannot reflect the real microcracks of the subsurface damage layer before corrosion. ...

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  • Holographic inversion detection method for micro-cracks on damaged layer of subsurface of brittle material
  • Holographic inversion detection method for micro-cracks on damaged layer of subsurface of brittle material
  • Holographic inversion detection method for micro-cracks on damaged layer of subsurface of brittle material

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Embodiment Construction

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] refer to figure 1 , the subsurface damaged layer 2 of the optical material includes a subsurface cracked layer 4 and an internal stress deformation layer 5 , and is covered by a polished layer 1 on the undamaged substrate 3 . Because it is below the surface, it is not easy to observe directly.

[0030] refer to figure 2 , the overall flow chart of the technical solution of the present invention includes on the basis of substrate pretreatment, the corrosion method is used to enlarge the crack and non-contact measurement is carried out to obtain three-dimensional basic data points, and the surface The data is reconstructed, and finally, the holographic inversion research method of micro-cracks in the sub-surface damaged layer is used to construct a detection and characterization system suitable for the holographic distribution...

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Abstract

The invention discloses a holographic inversion detection method for micro-cracks on a damaged layer of the subsurface of a brittle material. The invention is characterized in that: the surface of the brittle material after corrosion is reconstructed by using the method of fractal interpolation; the principle of self-similarity in the theory of fractal interpolation is adopted to fully depict complex microscopic morphology of the surface after corrosion; on the basis of reconstructing the material surface after corrosion by using the method of fractal interpolation, the finite difference method is used for inversion modeling of formation and growth of micro-cracks on the damaged layer of the subsurface, which enables not only the depth of the micro-cracks on the damaged layer of the subsurface but also all the information like size and direction of the micro-cracks to be obtained. An overall, complete and comprehensive characterization system of holographic distribution characteristics of micro-cracks on the damaged layer of the subsurface is brought forward on the basis of obtainment of holographic distribution characteristics of micro-cracks on the damaged layer of the subsurface.

Description

technical field [0001] The invention relates to the field of material surface quality detection, in particular to a method for detecting microcracks in subsurface damaged layers of brittle materials. Background technique [0002] High-precision (nanoscale) components involve ultra-precision processing, precision detection technology, optics and semiconductor fields in terms of technology, and high-end fields such as energy, space, defense equipment, integrated circuits and MEMS in terms of application. With the development of optics, microelectronics, MEMS and related technologies, the requirements for the surface quality of brittle materials involved in components are getting higher and higher. Whether it is high-end optical components or VLSI substrate materials, the surface integrity High requirements are put forward for the precision, which requires to ensure the processing quality of high-precision components to the greatest extent in the processing process. [0003] L...

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Application Information

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IPC IPC(8): G01N21/88
Inventor 王海容关赪张欢张碧柯蒋庄德
Owner XI AN JIAOTONG UNIV
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