Method for removing surface dust of mask plate
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI HUALI MICROELECTRONICS CORP
- Publication Date
- 2012-04-25
- Estimated Expiration
- Not applicable Β· inactive patent
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to a method for removing fine dust, in particular to a method for removing fine dust on the surface of a mask plate. Background technique
[0002] The mask used in the semiconductor chip manufacturing industry has high requirements on dust. When the particle size of the dust is large enough, it will be projected onto the silicon wafer during the photolithography process and destroy the chip circuit pattern, so it must be removed; clean the surface of the mask. The method of removing dust is generally to use blowing to remove the dust on the mask, such as blowing air gun to blow nitrogen air, air curtain, etc.; but because the surface of the mask is generally adsorbed with charged dust, such as figure 1 As shown, when the blowing air gun 3 is used for simple air blowing, the charged particles 4 cannot be removed when the air blowing pressure is low, and increasing the air blowing pressure will cause certain damage to the mask plate...