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FPC (Flexible Printed Circuit board) production method and FPC device

A production method, a square technology, applied to the assembly of printed circuits with electrical components, the structural connection of printed circuits, printed circuit components, etc., can solve problems affecting the performance of high-end products, achieve neat and beautiful packaging efficiency, and improve performance , The effect of improving production efficiency

Active Publication Date: 2014-02-19
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] That is, the customer needs to manually separate multiple units after placement, and a 0.3-0.8mm burr will be generated during the separation process; this burr will affect the performance of high-end products

Method used

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  • FPC (Flexible Printed Circuit board) production method and FPC device
  • FPC (Flexible Printed Circuit board) production method and FPC device
  • FPC (Flexible Printed Circuit board) production method and FPC device

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Embodiment 2

[0051] An FPC device provided in Embodiment 2 is basically similar in structure to the FPC device in Embodiment 1, and also includes an FPC entire board 100 (refer to figure 1 ), and a plurality of FPC units 200 formed by re-punching the entire FPC board 100, each of the FPC units 200 is connected to the entire FPC board 100 through a micro-connection point 110 at its edge.

[0052] The so-called difference in embodiment 2 is, as image 3 As shown, a protruding limiting ear copper sheet 102 is set on the double-sided circuit film of the scrap 101 corresponding to each micro-connection point 110 position on the periphery of each FPC unit 200, and the protruding limiting ear The ear copper skin 102 extends 0.03mm into the FPC unit 200, such as image 3 The shown h1 is 0.03 mm; and at the position of the corresponding micro-connection point in the FPC unit 200 , there is provided an inner concave line 106 that fits with the outer edge of the limiting ear copper skin 102 extendin...

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Abstract

The invention discloses an FPC (Flexible Printed Circuit board) production method and an FPC device. The FPC device comprises a complete FPC and a plurality of FPC units formed by re-punching on the complete FPC. Each FPC unit is connected on the complete FPC through a micro connecting point at the edge of the FPC unit. A scrap edge line film corresponds to the position of the corresponding micro connecting point on the outer periphery of each FPC unit is provided with an outward convex limit lug copper sheet; a covering film alignment line is arranged in each outward convex limit lug copper sheet; and an anti-tearing line is additionally arranged on one single-sided line film corresponding to the corresponding micro connecting point in each FPC unit. The invention provides a method for improving burrs after the PFC micro connecting points are torn out. The burrs can be effectively prevented from being generated after the FPC micro connecting points are torn out. The sizes of the generated burrs are reduced. The using performance of a product is improved. Moreover, the production efficiency of the product is improved and the scrappage of the product is reduced.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards (FPC), in particular to a method for improving burrs at micro-connection points of FPC after the board is torn off. Background technique [0002] Double-sided flexible boards are multiple units connected together and shipped to customers to facilitate customer surface assembly (also called SMT: SMT is Surface Mounted Technology, which simply means automatic soldering of leadless components) . [0003] In the existing technology, it is generally used to punch the shape of the whole board first, and then punch the unit. The units are connected to the connection point and shipped to the customer. A single piece of FPC and waste edge material, the single piece of FPC and the waste edge material are connected by a connection point. When removing a single piece of FPC from the connecting piece, the connection point needs to be torn off (that is, "separated"), and the fracture may be Bu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K3/36
Inventor 杨成君方董吴卫钟
Owner SHENZHEN KINWONG ELECTRONICS