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Chip heat-radiating device and electronic device

A technology for chip heat dissipation and electronic equipment, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of reduced PCB space utilization and occupation of PCB space, and achieve the effect of improving space utilization

Inactive Publication Date: 2012-05-02
HUAWEI DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the above-mentioned fixing method will occupy the space of the PCB, resulting in a reduction of the space utilization rate of the PCB.

Method used

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  • Chip heat-radiating device and electronic device
  • Chip heat-radiating device and electronic device
  • Chip heat-radiating device and electronic device

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Embodiment Construction

[0014] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0015] figure 1 A schematic structural diagram of a chip cooling device provided by an embodiment of the present invention, such as figure 1 As shown, the chip cooling device of this embodiment is arranged in an electronic device, and may include a flat heat sink 10, and at least one hole 20 is opened on the flat heat sink, and at least one hole ...

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PUM

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Abstract

The embodiment of the invention provides a chip heat-radiating device and an electronic device. The chip heat-radiating device is arranged in the electronic device, the chip heat-radiating device comprises a flat plate type heat radiator which is provided with at least one hole, and the hole is used for inserting a guide pillar on a shell of the electronic device so that the flat plate type heat radiator is fixed on the shell of the electronic device. According to the chip heat-radiating device and the electronic device, because the flat plate type heat radiator is fixed on the shell of the electronic device, the problem of occupying the space on the PCB because of fixing the flat plate type heat radiator on the PCB by using a screw in the prior art can be avoided, and the space utilization radio of the PCB is increased.

Description

technical field [0001] Embodiments of the present invention relate to heat dissipation technology, and in particular to a chip heat dissipation device and electronic equipment. Background technique [0002] During the use of electronic equipment, a chip set on a printed circuit board (PCB) will generate a large amount of heat during operation, which will cause formation of Hot spot. In order to solve this problem, it is necessary to add a flat heat sink on the chip. Generally speaking, screws can be used to fix the flat heat sink on the PCB. [0003] However, the above-mentioned fixing method will occupy the space of the PCB, resulting in a reduction of the utilization rate of the space of the PCB. Contents of the invention [0004] Embodiments of the present invention provide a chip cooling device and electronic equipment, which are used to improve the space utilization rate of PCB. [0005] One aspect of the present invention provides a chip heat dissipation device, ...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/40
Inventor 周列春许平阳军康南波
Owner HUAWEI DEVICE CO LTD
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