Element sealing body and method for producing the same
A manufacturing method and sealing body technology, which are applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of destroying substrate light-emitting elements, light-emitting elements not resistant to high heat, and insufficient gas shielding properties of sealants, etc. Achieve strong sealing, excellent tightness, and excellent gas barrier effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0064] Hereinafter, although the element sealing body of this invention is demonstrated in detail based on an Example, this invention is not limited to these Examples.
[0065] A rectangular transparent glass plate having a length of 100 mm, a width of 100 mm, and a thickness of 700 μm was used as a substrate glass. As the cover glass laminated on the substrate glass, a cover glass with a length of 80 mm, a width of 80 mm, and a thickness of 100 μm was used. The substrate glass and cover glass use alkali-free glass manufactured by NEC Glass Co., Ltd. (product name: OA-10G, coefficient of thermal expansion at 30 to 380°C: 38×10 -7 / °C). The glass formed by the overflow down-draw method is used in an unpolished state, or the surface roughness Ra is controlled by appropriately controlling the amount of grinding and chemical etching. Using AFM (Nanoscope III a) manufactured by Veeco, under conditions of a scan size of 10 μm, a scan frequency of 1 Hz, and a sample line of 512, th...
PUM
Property | Measurement | Unit |
---|---|---|
surface roughness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com