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Light-emitting device

A light-emitting device and light-emitting unit technology, which is applied to lighting devices, light sources, and components of lighting devices, etc., can solve the problems of poor design flexibility and increased manufacturing costs of light-emitting devices, and achieve the effects of improving design flexibility and reducing manufacturing costs.

Active Publication Date: 2013-11-13
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above problems, the technical problem to be solved by the present invention is to provide a light-emitting device, so as to improve the light-emitting diodes of the existing light-emitting device. , and the increase in manufacturing costs and other issues

Method used

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Embodiment Construction

[0067] The structural principle and working principle of the present invention will be described in detail below with reference to the accompanying drawings:

[0068] Figure 2 to Figure 4 It is a three-dimensional schematic diagram and a schematic circuit diagram of the first embodiment of the present invention. As shown in the figure, the light-emitting device 100 according to the first embodiment of the present invention includes a light-emitting unit 110 and a submount 120. Wherein, the light-emitting unit 110 is bonded to a side surface (ie, the top surface) of the sub-carrier 120 in a flip-chip bonding manner.

[0069] Compared with the existing wire bonding method, the light-emitting unit 110 and the sub-carrier 120 are combined with each other by flip chip bonding, which can greatly improve the alignment accuracy and reliability of the light-emitting device 100, thereby Reduce its assembly errors, and at the same time improve the limitation of excessive packaging volume ca...

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Abstract

A light-emitting device is disclosed, which comprises a light-emitting unit and a secondary carrier, wherein the light-emitting unit is provided with a plurality of light-emitting diodes, and a plurality of conducting contacts is disposed on the side surface of the secondary carrier. The light-emitting diodes are mutually coupled with the conducting contacts by means of various electric connections to cause the light-emitting diodes to be mutually connected in series or / and connected in parallel. A series electric connection is not performed on the plurality of light-emitting diodes of the light-emitting unit of the light-emitting device disclosed by the invention at first; and when the light-emitting unit is combined to the secondary carrier by means of flip chip, the plurality of light-emitting diodes can correspondingly form an electric connection relationship of mutual series connection or / and parallel connection via the different wiring designs of the plurality of conducting contacts of the secondary carrier, so as to enhance the design flexibility of the light-emitting device and decrease the manufacturing cost thereof; and the plurality of light-emitting diodes is suitable for composing a high-voltage light-emitting device.

Description

Technical field [0001] The present invention relates to a light emitting device, in particular to a flip chip packaged light emitting device, and the light emitting diodes in the light emitting device can be selectively connected in series or / and parallel. Background technique [0002] Light emitting diodes (LEDs) can be widely used in various applications, such as notebook computers, monitors, mobile phones, televisions and liquid crystal displays due to their low power consumption, high efficiency and long life. The light source of the backlight module. Furthermore, as more and more researchers invest in the research and development of light-emitting diodes (LEDs), the luminous intensity of current light-emitting diodes has reached the level of illumination. [0003] At present, the existing light-emitting diode structure is to place a single-chip type light-emitting diode on a semiconductor substrate, and set the positive and negative electrodes of the light-emitting diode chip...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/15H01L33/48H01L33/62F21V23/06F21Y101/02
Inventor 苏骅
Owner EPISTAR CORP
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