103results about How to "Increase design flexibility" patented technology

A semiconductor package and a method of fabricating the same. The semiconductor package includes a dielectric layer having opposite first and second surfaces; a semiconductor chip disposed on the first surface; at least two conductive pads embedded in and exposed from the first surface of the dielectric layer, and electrically connected to the semiconductor chip; a plurality of ball-implanting pads formed on the second surface of the dielectric layer; and a plurality of conductive pillars formed in the dielectric layer, each of the conductive pillars having a first end electrically connected to one of the ball-implanting pads and a second end opposing the first end and electrically connected to one of the conductive pads. Through the installation of the conductive pillars, it is not necessary for the ball-implanting pads to be associated with the conductive pads in position, and the semiconductor package thus has an adjustable ball-implanting area, so that wiring is more flexible.

The invention provides a fixed focus lens, comprising a first lens group, a second lens group and a third lens group which are sequentially arranged from the object side to the image side; the first lens group is provided with negative dioptre and comprises three lenses which are arranged from the object side to the image side; the lens of the first lens group closest to the object side is a non-spherical lens; the second lens group is provided with positive dioptre and comprises two lenses which are arranged from the object side to the image side; the third lens group is provided with positive dioptre and comprises six lenses which are arranged from the object side to the image side; furthermore, the dioptre of the lenses of the third lens group is sequentially negative, positive, negative, positive, positive and positive from the object side to the image side; the fixed focus lens meets the conditions as follows: (i) the absolute value of F1 / F is less than 3 and more than 0.2; (ii) F2 / F is less than 3 and more than 0.5; (iii) F3 / F is less than 3.5 and more than 0.5, wherein, F, F1, F2 and F3 are respectively the effective focus length of the fixed focus lens, the first lens group, the second lens group and the third lens group.

A device and a method for flame stabilization in a burner (10), includes a burner housing at least partially enclosing a burner volume, into which may be introduced via at least one fuel line, fuel, and via at least one air feed means, air, forming an air / fuel mixture spreading in a preferred flow direction, which may be ignited in a combustion chamber (11) connecting downstream of the burner housing to form a stationary flame (13). Upstream of the flame (13), a catalyst arrangement (1) is provided through which an air / pilot fuel mixture (4), separate from the air / fuel mixture, is flowable. The catalyst arrangement (1) has at least two catalyst stages which are located one behind the other in the through-flow direction, of which the catalyst stage (3) located upstream, the so-called POX-catalyst, is flow-washable by the air / pilot fuel mixture (4) with an air / pilot fuel mixture ratio λ<1, by which catalyst stage (3) the air / pilot fuel mixture (4) is partially oxidized, and of which catalyst stages the downstream catalyst stage (8), the so-called FOX-catalyst, is flow-washable by a leaned air / pilot fuel mixture (7) with a mixture ratio λ>1, by which the leaned air / pilot fuel mixture is completely oxidized forming an inert hot gas flow (9).

The invention discloses a light source circuit module with a reflective structure, and a backlight module and a display employing the same. The light source circuit module comprises a circuit board, a first reflective layer and a second reflective layer, wherein the first reflective layer is formed on the surface of the circuit board and has a first reflectivity, and the second reflective layer is formed on and partially covers the first reflective layer and has a second reflectivity higher than the first reflectivity. The overlapping area of the second reflective layer over the first reflective layer can be adjusted so as to adjust the reflectivity of the reflective structure formed by the first reflective layer and the second reflective layer, and to improve the uniformity of the light supplied by the light source circuit module, thereby solving the problem of graduated shade of the prior art due to nonuniform light supplied by a light source.

A high power light emitting diode module package structure at least comprises a substrate, a plurality of light emitting diodes and an insulated housing; wherein the substrate comprises a radiating base and multilayer line; the substrate is directly joined with the light emitting diode based on the assembly joining column raised on the radiating base, thereby effectively educing the heat source produced when running the light emitting diode; further, the multilayer line surrounding the assembly joining column can provide the winding for electrically connecting the assemblies in the module for strengthening the elasticity of the pattern design, thereby making a purpose of customized module, and having high reliability, high design elasticity, high thermal diffusivity and low cost.

The invention discloses a DDMS heavy draught upright post platform, which belongs to the technical field of ocean engineering and ship engineering, and is applicable to oil gas drilling and producing of an abyssal sea area. The upright post platform is characterized by consisting of four heavy draught upright posts, an upright post of a center well, a heave plate, a transverse pontoon bridge, a soft cabin, an anchoring system, a riser system and a platform upper part, wherein the four heave draught upright posts are arranged on four angular points of a cross section of the platform; the upright post of the center well is arranged in the center of the cross section; a K-shaped beam is arranged on the top of a hard cabin to connect the upright posts and the center well; the heave plate and the hard cabin of the platform are directly integrated into a whole, and are horizontally arranged on the upright posts; the transverse pontoon bridge is arranged on the bottom of the hard cabin to connect each upright post; and the soft cabin in large volume is arranged on the bottom of the platform and is filled with ballast weight. The platform has the advantages that building difficulty and cost of the platform are lower; the structure of the center well makes the upright posts protected; elasticity of global design and use space of the platform upper part are larger; hydrodynamic performance can be improved, so the platform has excellent motion performance; application of a dry-type tree is supported; and the platform is applicable to various conditions of different sea areas and sea conditions.

A system used for starting-up control hard disc in sequence comprises power supply module, at least one processing module and at least one control module. The said system is applied in electronic system with at least the first and the second hard discs and it can control total power supply signal value generated by start-up hard discs to not be over over-current protection value of power supply module for ensuring system start-up properly.

A multilayer filter includes a plurality of mutually coupled resonant circuits provided within a multilayer body. Capacitor internal electrodes, inductor internal electrodes, and inductor via electrodes, ground via electrodes, and input-output via electrodes are arranged within the multilayer body. The ground via electrodes and the input-output via electrodes are provided on a dielectric layer on a mounting surface, or a second dielectric layer on a first dielectric layer provided on the mounting surface. The capacitor internal electrodes arranged towards the side of the mounting surface do not overlap the input-output electrodes when viewed in plan view. With this configuration, degradation in frequency characteristics of a resonant circuit is effectively prevented by controlling one of an inductive component and a capacitive component of the resonant circuit.

The invention provides a light-emitting diode which comprises a light-emitting diode chip, a substrate structure, a fluorescent powder layer and a lens, wherein the substrate structure is provided with a concaved groove so that the light-emitting diode chip and the fluorescent powder layer can be arranged in the concaved groove at the same time; the lens is arranged on the substrate structure and provided with a curve side wall, the top of the lens is provided with a flat panel and an inverted cone-structure female cone is arranged in the center of the top.

The invention relates to a communication device, comprising a first circuit board, a second circuit board and an antenna. The first circuit board is arranged on the second circuit board, and is electrically connected with the second circuit board by a connecting point. The first circuit board comprises a clear zone, a plurality of key pads and a plurality of inductors, wherein the key pads correspond to the clear zone, and the inductors are respectively connected between the key pads in series for regulating the inductance of the key pads. The antenna comprises a radiation metal sheet which corresponds to the clear zone and is positioned at one side of the second circuit board so as to receive and transmit wireless signals. By the communication device, SAR value can be effectively reduced,and the design elasticity of the antenna limited by the design of the dimension of the communication device is increased.

A duplex fiber optic connector plug includes at least one fiber optic connector, a first casing, a second casing and a release lever. The release lever is axially coupled to a surface of the first casing and has an end coupled to a release bracket of the fiber optic connector to form a seesaw design. During operation, the release lever is compressed by the force of the finger, so that an end of the release lever is elevated, and the other end compresses the release bracket downward to release from a fiber optic socket, so as to provide an intuitively convenient operation and improve the convenience of use.

This invention relates to a condenser silicon-base micro-microphone processed with a micro-electromechanical process, which contains a back board wafer with a sound hole and a vibration wafer with vibrating film to form said micro-microphone by combining said two wafers.

The invention relates to a catoptric imaging system that comprises at least one light source, at least one light pipe arranged in front of the light source, an image panel arranged in front of the light pipe and a surface provided with at least the partial reflection characteristics of a mirror face. Light from the light source is irradiated to the image panel by the light pipe and an image on the image panel is projected to the surface to be reflected on a looker-on, thus forming a virtual image that can be seen by the looker-on. Owning to the light pipe of the invention, an incident light from the light source is reflected on the image panel with less light loss and higher directivity, so the looker-on can see the image with higher brightness. In addition, owning to the light pipe of the invention, the incident light from the light source can be irradiated to the image panel evenly, so the looker-on can see the image with uniform brightness and better quality.

The invention relates to a laser device for ophthalmology, comprising components for providing a first pulsed laser beam (140) having beam properties tuned for ablating corneal material, and a first pulsed laser beam (290) having beam properties tuned for introducing an incision in the eye tissue. The components comprise separate laser sources (110, 130) for generating the two laser beams, and a plurality of optical elements guiding the two laser beams on separate beam paths to each beam exit location and focusing the same on a focal point located outside of the beam exit location. According to the invention, the optical elements comprise an optical fiber (250) for guiding the second laser beam, wherein at least the two laser sources are located in a common housing (340) and at least part of the length of the optical fiber runs within the housing.

The invention discloses an antenna structure, at least comprising a radiation member, a feed-in needle and a substrate, wherein the substrate can be a printed circuit board. One end of the feed-in needle can be connected to the radiation member and the other end thereof is electrically connected with a microstrip line and an earth wire on the substrate. Owing to only one feed-in needle in the antenna structure, the design of the radiation member can be further improved to achieve that the feed-in needle is orthogonal to the earth wire. On one hand, available space of antenna can be increased to avoid internal metal elements and raise antenna efficiency, on the other hand, such a modification can also vary the field form of antenna radiation.

The invention relates to a constant current regulating circuit with a current sensing loop. The constant current regulating circuit comprises a current sensing loop, the current sensing loop is connected with the switch unit of the constant current regulating circuit and used for detecting the state of the current of the switch unit and generates a sensing current, the strength of which has a proportional relation with that of the current passing through the switch unit, and the sensing current generates a sensing voltage after passing through a sensing resistor. A differential amplifying circuit generates an error voltage to a pulse-width modulation controller according to a set voltage and the received sensing voltage, then the pulse-width modulation controller controls the switch motion of the switch unit through a grid drive circuit, so as to supply a constant current to the load connected with the output voltage terminal.

The invention relates to a sensing encapsulation part and a manufacturing method thereof. A sensing chip is arranged on and communicated to a load bearing part of a chip through a welding line to provide a light transmission body to be connected with the sensing chip with an interval of an adhesive layer, wherein, the size of a starting plane of the light transmission body is larger than the predetermined completion size of the sensing encapsulation part. A glue seal layer is formed on the load bearing part of the chip again to coat the sensing chip and the welding line and expose the upper surface of the light transmission body. Later, the cutting is carried out along the predetermined completion plane size of the sensing encapsulation part, thereby forming the sensing encapsulation part, the size of which is the same with the light transmission body. Furthermore, the contact area of the light transmission body and the glue seal layer is increased to strengthen the conjunction of the light transmission body.

A quick-flash memory programming and reading method comprises the steps: when programming, storing a last programming logical page number of a memory block of the quick-flash memory; when reading, according to the stored last programming logical page number, and cooperating with a logical page order and allocation of a preset memory block logical page allocation table, and judging programming times of a memory unit in the memory block; and according to the judged programming times, selecting a preset critical voltage, and performing a reading program to improve the reading efficiency.

The invention relates to a multi-finger gesture coding method and a coding system. The multi-finger gesture coding method comprises the following steps: firstly, sensing a plurality of inductors operated on a touch-control module to be used as a multi-finger gesture; secondly, deconstructing the multi-finger gesture as a plurality of gesture elements; thirdly, generating a plurality of track codes which respectively correspond to the gesture elements; and finally outputting the track codes. The invention senses the multi-finger gesture and judges the multi-finger gesture as a basic track code and can be used for an application to carry out an appointed function directly according to a combination of the track codes.

A rear-view mirror assembly is mounted to the side of a utility vehicle cab which comprises a door hinged to a front pillar of the cab. The assembly comprises a minor support bracket for supporting a rear-view mirror in a position which at least partly resides within a swept volume of the door. The support bracket is pivotally mounted to the cab and a rod is connected between the support bracket and the door. The mirror pivots upwardly to a position outside said swept volume as the door is opened, effectively ‘leapfrogging’ the door.

An optical touch module and an optical multi-touch device are disclosed. The optical touch module includes a glass panel, a control board unit and plural optical sensing sets. The glass panel is divided into a sensing zone and a peripheral zone surrounding the sensing zone. The control board unit is disposed on a rear surface of the glass panel and located completely within the peripheral zone. The optical sensing sets are disposed at intervals within the peripheral zone of the glass panel. The optical sensing sets are electrically connected to the control board unit, and the optical sensing sets and the control board unit jointly form a single-row serial connection structure.

A portable communication apparatus includes a first antenna radiator, a second antenna radiator, a first feeding point, a second feeding point, and a matching circuit. The first antenna radiator is used for radiating a high-frequency band signal. The second antenna radiator is used for radiating a low-frequency band signal. The first feeding point is coupled to the first antenna radiator and is utilized for processing feed-in or feed-out of the signal of first antenna radiator. The second feeding point is coupled to the second antenna radiator and is utilized for processing feed-in or feed-out of the signal of second antenna radiator. The first feeding point is separate from the second feeding point. The matching circuit is coupled to the first and second feeding points, and used for impedance matching with the first antenna radiator and the second antenna radiator.

The invention relates to a quick plugging / unplugging device for an adapter card, in particular to a quick plugging / unplugging device which is applicable to a PCIe adapter card, which mainly comprises a shell and a fixing unit, wherein the shell can be used for encasing a PCIe adapter card, and the fixing unit is arranged at the lateral side of the shell and / or the PCIe adapter card. When the PCIeadapter card is inserted in a PCIe slot, the quick plugging / unplugging device can clamp or buckle the PCIe slot, thus enhancing the stability of the PCIe adapter card inserted in the PCIe slot, realizing that the PCIe adapter card can be quickly plugged / unplugged, installed and fixed in the PCIe slot without using a tool, and therefore improving the circuit design flexibility for a computer system manufacturer.

A touch panel including a touch region, a border region, a signal transmission device, and a light transmission pattern is provided. The border region is disposed on at least one side of the touch region. The signal transmission device is disposed in the border region. The light transmission pattern is disposed in the border region. The light transmission pattern partially overlaps the signal transmission device along a vertical projection direction. The signal transmission device includes at least one transparent conducting line. The transparent conducting line overlaps partial the light transmission pattern in the vertical projection direction.

The invention relates to a wireless screen projection method, and a wireless screen projector and a conference system suitable for the wireless screen projection method. The wireless screen projectionmethod comprises the following steps: establishing communication connection with source equipment through a plug-and-play interface so as to display a preset storage space of the wireless screen projector to the source equipment and establish an HID channel between the wireless screen projector and the source equipment; loading the screen capture application program to the source equipment so asto run the screen capture application program on an operating system of the source equipment to perform screen capture operation to obtain screen projection picture data; automatically running the automatic screen projection application program to enable the energy equipment to transmit screen projection picture data through the HID channel; and receiving the screen projection picture data transmitted through the HID channel and sending the screen projection picture data to the display device in a wireless mode. According to the embodiment of the invention, a plug-and-play automatic screen projection starting mode is adopted, so that the screen projector does not need to be provided with a physical key, and the service life can be prolonged.

The invention provides an interposer substrate and a manufacture method thereof. A loading plate with a first line layer is provided, and the first line layer includes multiple first conductive poles; a first insulation layer is formed on the loading plate, and the first conductive poles are exposed; a second line layer is formed on the first conductive poles and electrically connected with the first conductive poles; multiple second conductive poles are formed on the second line layer; a second insulation layer is formed on the first insulation layer and wraps the second line layer and the second conductive poles, and the end surfaces of the second conductive poles are exposed; and the loading plate is removed. The end surfaces of the first conductive poles are of different geometric shapes except circle, and thus, laying can be carried out according to requirements, and the flexibility of design is improved.

An integrated circuit (IC) is provided. The IC includes a chip, a passivation layer, a first metal internal connection, a routing wire and a bonding area. The passivation layer is disposed on the chip, wherein the passivation layer has a first opening. The first metal internal connection is disposed under the passivation layer and disposed in the chip. The routing wire is disposed on the passivation layer, wherein a first end of the routing wire electrically connects to a first end of the first metal internal connection through the first opening of the passivation layer. The bonding area is disposed on the passivation layer, wherein the bonding area electrically connects to a second end of the routing wire.