High power light emitting diode module package structure

Abstract

A high power light emitting diode module package structure at least comprises a substrate, a plurality of light emitting diodes and an insulated housing; wherein the substrate comprises a radiating base and multilayer line; the substrate is directly joined with the light emitting diode based on the assembly joining column raised on the radiating base, thereby effectively educing the heat source produced when running the light emitting diode; further, the multilayer line surrounding the assembly joining column can provide the winding for electrically connecting the assemblies in the module for strengthening the elasticity of the pattern design, thereby making a purpose of customized module, and having high reliability, high design elasticity, high thermal diffusivity and low cost.

Description

Technical field: [0001] The invention relates to a high-power light-emitting diode module package structure, in particular to a heat dissipation requirement for high-power chips and a modular light-emitting diode package structure. Background technique: [0002] With the popularity of optoelectronic products and the continuous improvement of the power of LED chips, the modularization of multi-chip LEDs has gradually become a new trend in electronic lighting. Therefore, as the substrate for the electrical connection of LED multi-chip modules, its winding ability and heat dissipation It has become one of the key factors for the smooth development of new products. [0003] The heat-dissipating aluminum substrate developed in the early stage has the problem of poor overall heat-dissipating effect due to the resin contained below the position of the light-emitting diode components. see image 3 As shown in FIG. 1 , it is a cross-sectional schematic diagram of a package structure...

AI Technical Summary

Problems solved by technology

[0009] Although the component pads of the above-mentioned heat dissipation substrate and the heat dissipation plate are the same or integrally formed metal, the circuit is directly grown on the matured insulating material 91, so there are reliability problems such as poor adhesion; in addition, In addition to the expensive manufacturing process, the LED module manufactured in this way is still one of the biggest bottlenecks in module design due to the limitation of single-layer wiring winding.

[0010] In view of the problems encountered in the above-mentioned known technologies, it is generally impossible to meet the needs of users in actual use.

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