Inductance measuring encapsulation part and its making method

Abstract

The invention relates to a sensing encapsulation part and a manufacturing method thereof. A sensing chip is arranged on and communicated to a load bearing part of a chip through a welding line to provide a light transmission body to be connected with the sensing chip with an interval of an adhesive layer, wherein, the size of a starting plane of the light transmission body is larger than the predetermined completion size of the sensing encapsulation part. A glue seal layer is formed on the load bearing part of the chip again to coat the sensing chip and the welding line and expose the upper surface of the light transmission body. Later, the cutting is carried out along the predetermined completion plane size of the sensing encapsulation part, thereby forming the sensing encapsulation part, the size of which is the same with the light transmission body. Furthermore, the contact area of the light transmission body and the glue seal layer is increased to strengthen the conjunction of the light transmission body.

Description

technical field [0001] The invention relates to a semiconductor package and its manufacturing method, in particular to a sensing package and its manufacturing method. Background technique [0002] The traditional image sensor package mainly connects the sensor chip (Sensor chip) on a chip carrier, and electrically connects the sensor chip and the chip carrier through bonding wires, and then A glass is sealed above the sensing chip so that the image light can be obtained by the sensing chip. In this way, the image-sensing package with the completed structure can be installed by the system manufacturer on an external device such as a printed circuit board (PCB), for example, a digital camera (DSC), a digital video camera (DV), an optical mouse, etc. , mobile phones, fingerprint readers and other electronic products. [0003] In the existing sensing packages disclosed in U.S. Patent Nos. 6,060,340, 6,262,479, and 6,590,269, the dam structure is pre-prepared on the chip carrie...

AI Technical Summary

Problems solved by technology

[0005] However, in the aforementioned sensing package, since the glass 15 and the sensing chip 10 are joined by the adhesive layer 14 and part of the encapsulation material 16, it is often caused by poor adhesion when the temperature of the use environment changes. A crack C occurs at the joint between the side of the glass 15 and the packaging material 16, such as Figure 1B As shown, it may even lead to the intrusion of external water vapor or pollutants into the sensing chip 10, which seriously affects the life of the product.

[0006] Therefore, how to provide a sensing package and its manufacturing method can avoid being limited by the chip carrier and at least reserve enough space to place the dam structure, so that the size of the sensing package is limited, At the same time, due to the poor adhesion of the light-transmitting glass and the packaging material, cracks occur, and even external moisture or pollutants intrude into the package, etc., which is indeed an urgent issue in related fields.

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