Anti-counterfeiting integrated circuit (IC) card, and equipment and method for producing anti-counterfeiting IC card

A production equipment and anti-counterfeiting technology, which is applied to record carriers, instruments, and computer parts used in machines. It can solve problems such as potential safety hazards, and achieve the effects of preventing counterfeit cards, strong corrosion resistance, and high temperature resistance.

Active Publication Date: 2012-05-23
GOLDPAC GRP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] Therefore adopt IC card encapsulating process and the IC card of realization method in the prior art to produce

Method used

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  • Anti-counterfeiting integrated circuit (IC) card, and equipment and method for producing anti-counterfeiting IC card
  • Anti-counterfeiting integrated circuit (IC) card, and equipment and method for producing anti-counterfeiting IC card
  • Anti-counterfeiting integrated circuit (IC) card, and equipment and method for producing anti-counterfeiting IC card

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Embodiment Construction

[0051] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and examples.

[0052] The invention discloses an anti-counterfeit IC card, see figure 1 , including a sheet-shaped card base 6, a recessed cavity from the surface of the card base 6, and an IC chip 5; the IC chip 5 is embedded in the cavity, and the IC chip 5 is bonded to the wall of the cavity by hot melt adhesive 4 ; Wherein, between the bottom of the cavity and the IC chip 5, a high-strength adhesive 1 is also accommodated.

[0053] Described groove cavity comprises bottom layer groove cavity 2 and first layer groove cavity 3, and the width dimension of described first layer groove cavity 3 is greater than the width dimension of bottom layer groove cavity 2, is consistent with the stepped cross-sectional shape of IC chip 5; Between the cavity 3 and the IC chip 5 is an adhesive layer of hot melt adhesive 4 ; between the bottom cavity cavity ...

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Abstract

The invention relates to an anti-counterfeiting integrated circuit (IC) card, and equipment and a method for producing the anti-counterfeiting IC card. The anti-counterfeiting IC card comprises a sheet card base, a groove cavity which is recessed from the surface of the card base, and an IC chip, wherein the IC chip is embedded into the groove cavity and adhered to the wall surface of the groove cavity through a hot-melting adhesive; a high-intensity adhesive is also accommodated between the bottom of the groove cavity and the IC chip; and the IC chip is packaged by using the adhesive which has high adhesion force, high temperature resistance and high corrosion resistance, so that the counterfeiting of the IC card which is melted and dissolved is prevented. By adding an adhesive-dripping program control unit to the conventional IC card packaging machine, the IC card can be packaged by using a GD IC adhesive, so that the industry technical problems that the conventional IC card is low in temperature resistance and corrosion resistance, and a counterfeit card can be easily manufactured are solved, the packaging stability and yield of the IC card can be guaranteed in the packaging process of the IC card, and the manufacturing difficulty of the counterfeited IC card can be greatly improved.

Description

technical field [0001] The invention belongs to the technical field of transaction cards and their manufacture, and in particular relates to a novel anti-counterfeit IC card and its production equipment and production method, which are used for automatic production of anti-counterfeit IC cards. Background technique [0002] With the popularization and application of IC cards, IC cards have been widely used in finance, social security, transportation and other fields. At the same time, there are more and more counterfeit card frauds, and the amount of fraud losses is also increasing. [0003] IC card production implementation method generally includes the following five steps in the prior art: [0004] The first step: IC card base production; [0005] The second step: IC card base milling groove; [0006] The third step: prepare hot melt adhesive for IC chip; [0007] The fourth step: IC chip hot pressing; [0008] Step 5: IC chip cold pressing. [0009] That is, the IC ...

Claims

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Application Information

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IPC IPC(8): G06K19/077
Inventor 王檄覃琥冼伟盛曾建国
Owner GOLDPAC GRP LTD
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