Circuit substrate and manufacturing method of circuit substrate
A technology of circuit substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit parts, etc., can solve the problems of increased manufacturing cost, long manufacturing time, and inability to manufacture circuit substrates, etc., to reduce manufacturing cost and shorten manufacturing process. the effect of time
Inactive Publication Date: 2012-05-23
SONY CORP
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Problems solved by technology
[0011] However, the above-mentioned manufacturing method using a photocatalyst disclosed in Japanese Unexamined Patent Application Publication No. 2004-87976 and Japanese Unexamined Patent Application Publication No. 2009-81441 has the problem that, in the photolithography method, such as used for photocatalyst Processes such as photoreaction development process and exposure process are necessary, so the circuit board cannot be manufactured through a simple process, and the manufacturing time is long and the manufacturing cost is increased.
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Embodiment Construction
[0055] Hereinafter, embodiments of a circuit substrate and a method of manufacturing the same are explained with reference to the accompanying drawings.
[0056] Forming a fine conductive pattern (wiring layer) by a printing method enables the circuit substrate and its manufacturing method of the present invention to reduce environmental load or realize low cost. Therefore, the following best mode is applied to a circuit substrate manufactured by printable electronics technology and a method of manufacturing the same.
[0057] For example, circuit substrates manufactured by printable electronics are applied to flat panel displays such as liquid crystal displays, plasma displays, or organic electroluminescent displays, among others.
[0058] In the following, for example, directions in a case where a substrate on which a wiring layer is formed and serves as a material to be printed are arranged in the up-and-down direction are described. However, embodiments of the present inv...
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Abstract
The present invention relates to a circuit substrate and a manufacturing method of the circuit substrate. The circuit substrate includes a substrate having a wiring formation surface formed in a planar shape; a primer resin layer formed on the wiring formation surface of the substrate and having a predetermined adhesive force with respect to the substrate; and a wiring layer formed on the primer resin layer, wherein the wiring layer is formed by removing a portion of the conductive ink, which contacts the wiring formation surface of the substrate coated so as to cover the primer resin layer by a removing unit, in which the adhesive force of a conductive ink with respect to the substrate is smaller than the adhesive force of the primer resin layer with respect to the substrate. The circuit substrate of the present invention is manufactured in a simple process, thus the manufacturing time is shortened and the manufacturing cost is decreased, and a position precision of the wiring layer is also raised.
Description
[0001] Cross References to Related Applications [0002] The present application contains subject matter related to the disclosure of Japanese Priority Patent Application JP 2010-251268 filed in the Japan Patent Office on Nov. 9, 2010, the entire content of which is hereby incorporated by reference. technical field [0003] The present invention relates to a circuit substrate and a manufacturing method thereof. Specifically, the present invention manufactures a substrate having a high-definition wiring layer through a simple process by applying a conductive ink to cover a primer resin layer formed on a substrate and removing a portion of the conductive ink that is in contact with the substrate . Background technique [0004] In various types of electronic devices, a circuit substrate is arranged, and a predetermined conductive pattern (wiring layer) is formed in the circuit substrate. [0005] For example, the circuit substrate can be manufactured by a photolithography met...
Claims
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IPC IPC(8): H05K1/02H05K3/12
CPCH05K2203/0522H05K3/386H05K3/1283H05K2203/0143H05K3/04Y10T29/49155
Inventor 尼子博久
Owner SONY CORP