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Wire connection device and connection method for semiconductor unit

A wire connection and semiconductor technology, which is applied in the field of wire connection devices, can solve problems such as poor wire connection, wire stripping, and inability to connect and fix wires.

Inactive Publication Date: 2016-08-03
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the conductive tape 3 cannot be used to connect and fix the wires to the semiconductor unit with sufficient strength, which may cause the wires to peel off, or cause connection failures such as the wires not being reliably electrically connected to the semiconductor unit.

Method used

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  • Wire connection device and connection method for semiconductor unit
  • Wire connection device and connection method for semiconductor unit
  • Wire connection device and connection method for semiconductor unit

Examples

Experimental program
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Embodiment Construction

[0027] Embodiments of the present invention will be described below with reference to the drawings.

[0028] Figure 1 to Figure 3 The first embodiment of the present invention is shown. figure 1 It is a pair of endless belts 11 (in figure 1 In the illustration, only one endless belt 11) is conveyed in the direction of arrow X, and a string 1A (string) formed by connecting a plurality of semiconductor units 1 having a quadrangular planar shape in a row with a wire 2 bent into a crank shape is conveyed. Front view of the wire connection device.

[0029] That is, a plurality of semiconductor units 1 such as Figure 5 (a), Figure 5 As shown in (b), in the width direction intersecting with the conveying direction, three lead wires 2 are respectively bonded to the semiconductor unit 1 by virtual pressure through a conductive tape 3 formed of an adhesive thermosetting resin as a conductive member. The upper surface and the lower surface of the , thereby forming the above-menti...

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PUM

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Abstract

The invention relates to a lead connecting apparatus and method for a semiconductor unit. The lead connecting apparatus comprises: a ring-like strip (11) that carries a plurality of semiconductor units (1) connected into one column by the visually connected lead (2) along the regulated direction, pressurization tools (19, 21) which carry out solid pressure welding by pressing and heating on visually connected lead section of the semiconductor units carried and positioned by ring-like strip, and a temperature rise preventing mechanism (34) that prevents the temperature rise of a conductive adhesive tape for the semiconductor units having the lead connected to the upstream side of the delivering direction when the lead is solidly connected to the to-be carried and positioned semiconductor unit via a pressing tool resulting from the heating of the pressing tool.

Description

technical field [0001] The present invention relates to a lead wire connection device and a connection method for connecting a plurality of semiconductor units used in a solar cell module into a row through wires. Background technique [0002] There are crystalline and thin-film solar cell modules. In a crystalline solar cell module, semiconductor cells such as single crystal silicon or polycrystalline silicon are connected in a row by wires, and the semiconductor cells are integrally laminated with resin on a glass substrate. Patent Document 1 discloses a solar cell module having such a structure. [0003] The solar cell module shown in Patent Document 1 utilizes a strip-shaped wire that is a connecting member that is bent into a crank shape via, for example, a conductive tape as a conductive member disposed on the surfaces of two solar cell cells, that is, two semiconductor cells. electrical connection. [0004] To connect the two semiconductor units by the above wire, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L31/05
CPCY02E10/50Y02P70/50
Inventor 安部光仁堀内真司奥大辅
Owner SHIBAURA MECHATRONICS CORP
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