Method and device for cleaning support plate and substrate film-plating device
A technology for coating equipment and substrates, applied in cleaning methods and appliances, cleaning methods using gas flow, chemical instruments and methods, etc.
Active Publication Date: 2014-11-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0007]Using high-pressure gas purging can generally only remove the part where the film layer is loosely bonded to the carrier, but it is difficult to remove the denser film layer
When the carrier plate is heated in the loading heating chamber, the above-mentioned unremoved film layer is easy to peel off, which will also cause particle contamination and affect the processing quality of the wafer
Method used
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Embodiment Construction
[0043] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the carrier cleaning method, device and substrate coating equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0044] see figure 2, is a schematic flow chart of the carrier plate cleaning method provided by the present invention. The carrier plate cleaning method is used to clean the carrier plate in the substrate coating equipment to remove the film layer attached to the surface of the carrier plate, which at least includes: step 20), spraying the cleaning medium on the surface of the carrier plate to remove the The film layer on the surface of the carrier board. Specifically, the pressure, flow rate, particle size and other parameters of the cleaning medium are controlled to impact the film layer on the surface of the carrier to destroy the bonding force between the film layer and t...
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The invention provides a method for cleaning a support plate. The method at least comprises the step 20 of spraying a cleaning medium on the surface of the support plate to remove a coating attached on the surface of the support plate. The invention also provides a device for cleaning the support plate, at least comprising a module for cleaning the support plate, which is used to spray the cleaning medium on the surface of the support plate so as to remove the coating attached on the surface of the support plate. By adopting the method and / or device for cleaning the support plate, provided by the invention, the on-line cleaning of the support plate can be realized in a substrate film-plating device; and the method and device have the advantages of high cleaning efficiency, good cleaning effect and the like. In addition, the invention also provides a substrate film-plating device applying the method and / or device for cleaning the support plate.
Description
technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a method and device for cleaning a carrier plate and substrate coating equipment using the method / device. Background technique [0002] In the production process of microelectronic products, it is often necessary to perform various film preparation processes on the surface of the substrate. Taking the production of crystalline silicon solar cells as an example, to make a solar cell, it is necessary to prepare multiple layers of different types of thin films on the surface of the substrate. [0003] At present, a plasma-enhanced chemical vapor deposition equipment is often used to prepare the above-mentioned film layer. The plasma coating equipment mainly includes a loading heating chamber, a process chamber, an unloading cooling chamber, an unloading table and other components. During the process, the substrate is switched between different chambers by means ...
Claims
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IPC IPC(8): B08B7/00B08B5/02C23C16/44
Inventor 姚立强
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD