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SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling

A wire bonding and screen printing technology, applied in the manufacture of semiconductor/solid state devices, record carriers used in machines, instruments, etc. Stability, avoid high cost, improve the effect of stability

Inactive Publication Date: 2012-06-13
北京六所新华科电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2. The implantation of bumps occupies the limited space of the SIM film card. Therefore, in order to meet the inherent thickness requirements of the product, the chip needs to be thinned by 70um to 90um, and it is very easy to cause problems for products with a chip size larger than 1.5mm*1.5mm. Chip fragmentation occurs during the processing of the product, which increases the loss of the product during processing
[0007] Due to the limitations of the above shortcomings, the packaging cost of surface mount cards has increased, which has greatly reduced the ability of surface mount card production and marketing

Method used

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  • SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling
  • SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling
  • SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling

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Embodiment Construction

[0034] 1. Processing and production of a flexible circuit board for SIM film cards with metal bumps, the position of the metal bumps meets the requirements of the 7816 location area. On the side of the flexible circuit board with metal bumps, there are areas for mounting chips and pads using wire bonding. The pads pass through the lines of the flexible circuit board and are respectively connected to the metal points of the SIM film card and the SIM film card. The pins are connected, so that one side has a physical interface physically connected to a mobile phone terminal Universal Integrated Circuit Card (UICC), and the other side has a physical interface physically connected to a standard Universal Integrated Circuit Card (UICC).

[0035] 2. The flexible circuit board assembly of the SIM film card is designed as follows: a single splicing unit flexible circuit board substrate contains multiple SIM film card flexible circuit boards, and the entire substrate can also be composed...

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Abstract

The invention relates to an SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling. The method comprises the following processes that: a bonding agent is used to enable a bare chip that has been thinned and scribed to be bonded to an SIM pasting film card flexible circuit board; lead bonding is employed to enable a chip pad to be electrically connected with the SIM pasting film card flexible circuit board; and a screen printing method is utilized in a mounting region of the SIM pasting film card, so that the mounting region of the chip is sealed by a rubber compound packet. According to the SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling in the invention, the whole thickness of the SIM pasting film card is reduced; capabilities of extrusion resistance and bending resistance of the SIM pasting film card during the using process can be effectively improved, so that the quality of the SIM pasting film card becomes more stable; and meanwhile, batch processing of the SIM pasting film cards can be realized.

Description

technical field [0001] The invention belongs to the technical field of electronic semiconductor packaging, and in particular relates to a method for packaging and manufacturing a SIM film card. technical background [0002] The SIM film card is a film card pasted on the surface of the SIM card of the mobile phone. After the film card is connected with the SIM card and the mobile phone card holder and inserted into the mobile phone card holder, the product that realizes its related extended functions through the calculation of the built-in security chip of the film card, such as: mobile phone mobile payment. [0003] Since the SIM film card uses the gap space between the mobile phone card holder and the SIM card, stick the SIM film card on the SIM card and use it together, and the gap space between the mobile phone card holder and the SIM card is very small. Generally, the SIM film card needs to be controlled at 0.4 Only mm or less can be applied to the card holders and SIM ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/56H01L23/31G06K19/077
CPCH01L2224/48095H01L2224/48465H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012
Inventor 赵晴张宇张杨
Owner 北京六所新华科电子技术有限公司
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