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Circuit wiring board incorporating heat resistant substrate

A technology for heat-resistant substrates and circuit boards, applied in circuits, printed circuits, printed circuits, etc., can solve problems such as low connection reliability and reduced reliability.

Active Publication Date: 2012-06-13
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Connections by solder reflow are less reliable than connections by moving electric charges by plating, etc., and there is a problem that reliability decreases as the number of pads increases.

Method used

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  • Circuit wiring board incorporating heat resistant substrate
  • Circuit wiring board incorporating heat resistant substrate
  • Circuit wiring board incorporating heat resistant substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] 1. Resin package substrate

[0040] figure 1 The structure of the built-in heat-resistant substrate circuit board of Example 1 constituting the resin package substrate is shown. The heat-resistant substrate built-in circuit board 10 includes a heat-resistant substrate 30 built therein. The heat-resistant substrate 30 has a base material (core substrate) 20 . Via-hole conductors 36 are provided on base material 20 , and via-hole lands 38 are formed at both ends of via-hole conductors 36 . Conductive circuits 39 are formed on both surfaces of the core substrate 20 . On both sides of the substrate 20, a rewiring layer composed of via hole conductors 48, conductive circuits 49, and insulating layer 40 and a rewiring layer (build-up layer) composed of via hole conductors 148, conductive circuits 149, and insulating layer 140 are disposed. wiring layer). Solder resist layers 70 are formed on the front and back surfaces of built-in heat-resistant substrate circuit board ...

Embodiment 2

[0092] Figure 8 The structure of the built-in heat-resistant substrate circuit board of Example 2 is shown. The heat-resistant substrate built-in circuit board 10 includes a heat-resistant substrate 30 built therein. The heat-resistant substrate 30 has a base material 20 , the base material 20 is provided with via-hole conductors 36 , and via-hole lands 38 are formed at both ends of the via-hole conductors 36 . A built-up wiring layer composed of via-hole conductors 48 and insulating layer 40 is arranged on the IC chip-side surface (upper surface) of heat-resistant substrate 30 . There is no redistribution layer on the back side. A solder bump 78U is provided in the opening 70 a of the solder resist layer 70 of the via-hole conductor 48 . The IC chip (MPU) 90A and the IC chip (memory) 90B are mounted by connecting the electrodes 92 of the IC chip 90A and the IC chip 90B via the solder bumps 78U.

[0093] The thickness of the built-in heat-resistant substrate circuit board...

Embodiment 3

[0096] refer to Figure 9 The structure of the heat-resistant substrate built-in circuit board of Example 3 will be described.

[0097] in reference to figure 1 In the first embodiment described above, the rewiring layers were provided on both surfaces of the core substrate. On the other hand, in Example 3, no rewiring layer was provided on the core substrate. In the structure of Embodiment 3, it is also possible to use the core substrate 20 to thin the built-in heat-resistant substrate circuit board, and to make the mounted IC chip (Chip set) 90A, IC chip (GPLI) 90B and the built-in heat-resistant substrate circuit The coefficients of thermal expansion of the board 10 are close to prevent disconnection due to thermal shrinkage.

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PUM

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Abstract

This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance.

Description

[0001] This application is a divisional application of an invention application with a filing date of "April 20, 2007", an application number of "2007800071626 (PCT / JP2007 / 058587)", and an invention title of "built-in heat-resistant substrate circuit board". technical field [0002] The present invention relates to a built-in heat-resistant substrate circuit board having a built-in heat-resistant substrate, and particularly relates to a built-in heat-resistant substrate circuit board suitable for use as a packaging substrate for mounting IC chips. Background technique [0003] Japanese Patent Application Laid-Open No. 2002-344142 discloses a multilayer printed wiring board in which interlayer resins are alternately laminated on a resinous core substrate having via-hole conductors as a multilayer printed wiring board for mounting IC chips. insulating layer and conductor layer, and connect the conductor layers with via hole conductors. [0004] Japanese Patent Application Laid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H01L23/498H01L21/48
CPCH05K3/4602H05K3/4688H01L21/486H01L2924/01046H05K1/112H01L2924/15174H01L23/49827H01L2924/3011H01L2924/01079H01L2224/16H01L2924/01019H05K2201/0187H01L2924/15311H01L21/4857H01L23/49822H01L2924/01078H01L2924/01057H05K2201/10674H01L2224/16225H01L2224/16235H01L2224/05573H01L2224/05568H01L2924/00014H01L2224/05599H05K1/02H05K7/20H05K3/46
Inventor 苅谷隆古谷俊树河西猛
Owner IBIDEN CO LTD