Ceramic substrate assembly and grounding welding method thereof

Abstract

The invention relates to a ceramic substrate assembly and a grounding welding method thereof. The ceramic substrate assembly comprises a ceramic circuit substrate, a pressing block and a box body. Limiting convex points are arranged on two sides of the ceramic circuit substrate, welding flux is coated on the ceramic circuit substrate, the ceramic circuit substrate is fixed with the pressing block and fixed in the box body, and a gap is reserved between the outer side of the ceramic circuit substrate and the wall of the box body. The ceramic substrate assembly grounding welding method comprises the following steps: putting the ceramic substrate assembly on a heating board in a welding cabin of a vacuum welding furnace, and closing a cabin door; increasing the temperature to 60 DEG C, retaining the temperature for 1 minute, then vacuuming and filling nitrogen, increasing the temperature to 130 DEG C, retaining the temperature for 1 minute, then increasing the temperature to 200 DEG C, retaining the temperature for 1.5 minutes, then vacuuming and filling nitrogen, reducing the temperature to be lower than a welding paste melting point. According to the ceramic substrate assembly and the grounding welding method, the residue of the welding flux on the ceramic circuit substrate can be extracted by vacuumizing, the problem of accumulation of the residues of the welding flux in the traditional welding method can be avoided, the penetration rate is increased, the cleaning is easier, and the operation is convenient.

Description

technical field [0001] The invention relates to a ceramic substrate, in particular to a ceramic substrate assembly and a grounding welding method thereof. Background technique [0002] Microwave components developed based on ceramic technology have technical advantages such as high integration density, multiple circuit functions and high reliability. The quality of the connection between the ceramic substrate and the box directly determines the grounding performance and heat dissipation of the product. At present, the connection between the foreign ceramic circuit board and the bottom of the box body is generally realized by brazing method. The solder used in the brazing method includes two types of solder sheet and solder. The solder sheet has different degrees of oxidation on the surface. It is difficult to completely restore during the area welding process, resulting in the formation of welding voids on the welding surface. The literature LTCC circuit substrate large-ar...

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Problems solved by technology

The process of this method is relatively complicated, and the accumulation of solder in the soldering process hinders the discharge of solder, and a large amount of solder remains in the soldering surface, forming soldering voids, which will cause pollution in the secondary heating process of the subsequent process. It is also difficult to clean the residual solder in the

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