Silicon chip taking and placing device
A technology for picking and placing devices and silicon wafers, which is applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve problems affecting the production process of silicon wafers, so as to improve the production efficiency of silicon wafers, ensure smooth production, and ensure the production of silicon wafers The effect of the process
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[0019] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0020] As shown in the figure: the silicon chip pick-and-place device of the present invention is mainly composed of a suction cup 1, a connecting seat 2, a lower end cover 3, a valve body 4, an upper end cover 5, a sealing ring 6, a negative pressure sensor 7, a display 8, a first Parts such as joint 9 and second joint 10 are formed.
[0021] Such as Figure 1~Figure 3 As shown, the suction cup 1 is fixed on the connection base 2 by screws, the suction cup 1 is provided with a plurality of air holes 1a, and the connection base 2 is provided with a cavity 2a. The lower end cover 3 is fixed on the connection base 2 by screws, and the center of the lower end cover 3 is provided with a lower ventilation hole 3a, which communicates with the concave cavity 2a in the connection base 2. The valve body 4 is fixed on the lower end cover 3 by screws, and a sealing ring...
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