Bundle membrane material highly radiating structure and manufacturing method thereof

Abstract

The invention provides a bundle membrane material highly radiating structure and a manufacturing method thereof, and belongs to the technical field of radiating. The structure comprises a radiating substrate made of a metal material, and two or more drum highly radiating membranes fixed on the radiating substrate, wherein the drum highly radiating membranes form a radiating bundle on the radiating substrate. The manufacturing method comprises the following steps of: 1, manufacturing the drum highly radiating membranes by using highly radiating membrane materials, and forming crossed preformed holes in the radiating substrate; 2, inserting the drum highly radiating membranes into the preformed holes in the radiating substrate; 3, heating the drum highly radiating membranes to ensure that the edges of the preformed holes in the radiating substrate are melted; and 4, cooling to ensure that the drum highly radiating membranes are fixed on the radiating substrate. The drum highly radiating membranes are made into the bundle on the radiating substrate, so that the radiating area is greatly increased, and radiating performance is improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation. technical background [0002] Electronic products, machinery, electric power, communications, chemical industry and many other fields will generate different amounts of heat in the process of product processing, production and use. Moreover, if the generated heat cannot be effectively dissipated, it may affect the processing and use of the product. [0003] At present, various heat dissipation materials have been widely used. Different types of heat dissipation materials have different properties. For example, metal materials have good thermal conductivity, especially some metal materials, such as copper, aluminum, silver, etc., have particularly good thermal conductivity. Radiators made of these metals, such as copper radiators and aluminum radiators, are also widely used. [0004] The thermal conductivity properties of some commonly used heat dissipation materials are listed below: ...

AI Technical Summary

Problems solved by technology

Although the above-mentioned metals are relatively common as heat dissipation materials, their heat dissipation performance is still relatively low. With the emergence of film materials with high heat dissipation performance, the heat dissipation equipment made of them is getting closer and closer to them.

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