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Highlighted LED (light-emitting diode) optical coupling device

An optical coupling device and optical coupling technology, applied in the coupling of optical waveguides and other directions, can solve problems such as damage to LED chips, retention of air gaps, and reduction of service life.

Active Publication Date: 2012-07-04
熊大曦
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing high-brightness LED optical coupling device includes a substrate and an LED chip module mounted on the substrate, and also includes an optical coupling device covered on the LED chip module, and the optical coupling device includes packaging the LED The packaging layer of the chip module and the optical coupler arranged on the packaging layer, in order to prevent the optical coupler from damaging the LED chip module, there is an air gap or glass between the optical coupler and the LED chip module, and the gap between the air and the glass The optical refractive index is quite different from that of the optical coupler, which greatly reduces the efficiency of the light emitted by the LED chip module entering the optical coupler. In order to improve the optical coupling efficiency, some systems try to make the light-emitting surface and the optical The device is close, but it is difficult to control during operation, and if the gap is too small, it may vibrate, and the contact between the optical device and the contact surface will damage the LED chip and reduce the service life
Such as Yang Yi et al [CN 101802666A] proposed a method to improve the optical coupling efficiency, but still retain the air gap; Catherine et al [CN 101438201A] proposed to use glass with a refractive index of 2.0 or above to improve the light extraction efficiency, but in reality There is no such material

Method used

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  • Highlighted LED (light-emitting diode) optical coupling device
  • Highlighted LED (light-emitting diode) optical coupling device
  • Highlighted LED (light-emitting diode) optical coupling device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Such as figure 1 As shown, a high-brightness LED optical coupling device includes a substrate 1 and an LED chip module 2 mounted on the substrate, and also includes an optical coupling device covered on the LED chip module, and the optical coupling The device includes an encapsulation layer 3 encapsulating the LED chip module 2 and an optical coupler 4 directly arranged on the encapsulation layer.

[0021] The encapsulation layer 3 is made of resin or silica gel, etc., the optical coupler 4 is an optical rod, the optical refraction index of the optical rod is 1.56, and the optical refraction index of the resin is 1.52, ensuring that the encapsulation layer 3 and all The difference between the optical refractive indices of the optical couplers is within ±0.5.

[0022] The light rod is bonded to the encapsulation layer 3 by the same resin / silica gel, and the overall similar optical refractive index ensures the optical coupling efficiency of the entire coupling device, so...

Embodiment 2

[0025] Such as figure 2 As shown, the rest is the same as that of Embodiment 1, except that the upper surface of the encapsulation layer 3 is flush with the upper surface of the LED chip module 2 . Therefore, the light rod is directly bonded to the LED chip module 2 through the resin, further reducing the influence caused by the difference in refractive index.

[0026] In the above embodiments, the encapsulation layer 3 may also be quartz. The optical coupler 4 can also be an optical fiber.

[0027] The adhesive between the optical coupler 4 and the encapsulation layer 3 can also be made of silica gel, and the difference between the optical refractive index of the silica gel and the optical coupler is ±0.5.

[0028] Wherein, the effective light-emitting area of ​​the LED chip module 2 is equal to or smaller than the cross-section of the optical coupler 4 , that is, the vertical projection of the optical coupler 4 covers the entire light-emitting surface of the LED chip modu...

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PUM

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Abstract

The invention discloses a highlighted LED (light-emitting diode) optical coupling device which comprises a substrate, an LED chip module and an optical coupling device, wherein the LED chip module is arranged on the substrate, and the optical coupling device covers the LED chip module; and the optical coupling device comprises an encapsulation layer for encapsulating the LED chip module and an optical coupler directly arranged on the encapsulation layer. Through adoption of the technical scheme, the highlighted LED optical coupling device disclosed by the invention has the advantages that through directly arranging the optical coupler on the encapsulation layer and not using an air gap or glass and the like which influences the optical coupling efficiency, the optical coupling efficiency is greatly improved; and through direct connection, the LED chip module can be prevented from being damaged by vibration, thereby greatly improving the service life.

Description

technical field [0001] The invention relates to an LED lighting product, in particular to a high-brightness LED optical coupling device. Background technique [0002] With the rapid development of LED technology and the maturity of high-power LED production technology, its low power consumption, high efficiency, small size, light weight and long life and many other advantages make it widely used. The development of high-power LED packaging technology , greatly accelerating the application of high-power LEDs in the field of lighting and display. [0003] The existing high-brightness LED optical coupling device includes a substrate and an LED chip module mounted on the substrate, and also includes an optical coupling device covered on the LED chip module, and the optical coupling device includes packaging the LED The packaging layer of the chip module and the optical coupler arranged on the packaging layer, in order to prevent the optical coupler from damaging the LED chip mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
Inventor 熊大曦
Owner 熊大曦