Unlock instant, AI-driven research and patent intelligence for your innovation.

Positive photosensitive resin composition, cured film, method for forming the same, interlayer insulating film, and display device

A photosensitive resin and composition technology, applied in optics, optomechanical equipment, nonlinear optics, etc., can solve the problems of low dielectric constant and no photosensitive resin found.

Inactive Publication Date: 2016-07-06
FUJIFILM CORP
View PDF32 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As mentioned above, when the interlayer insulating film is formed from a photosensitive resin composition, the composition is required to be highly sensitive, and the interlayer insulating film formed from the composition is required to have various properties such as low dielectric constant and high transmittance. These properties are comprehensively excellent, but no photosensitive resin composition satisfying this requirement has been found in the past.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Positive photosensitive resin composition, cured film, method for forming the same, interlayer insulating film, and display device
  • Positive photosensitive resin composition, cured film, method for forming the same, interlayer insulating film, and display device
  • Positive photosensitive resin composition, cured film, method for forming the same, interlayer insulating film, and display device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0455]

[0456] A photosensitive resin composition is prepared by mixing various components at a predetermined ratio by an arbitrary method, stirring and dissolving them. For example, it is also possible to prepare a resin composition by preparing a solution obtained by dissolving each component in the (E) solvent in advance, and then mixing them at a predetermined ratio. The composition solution prepared in this manner can also be used after being filtered through a filter with a pore size of 0.2 μm or the like.

[0457]

[0458]A desired dry coating film can be formed by applying a photosensitive resin composition to a predetermined substrate and removing the solvent by reducing pressure and / or heating (prebaking). As the substrate, for example, in the manufacture of a liquid crystal display element, a glass plate provided with a polarizing plate, further provided with a black matrix layer, a color filter layer, and further provided with a transparent conductive circuit ...

example

[0483] The following examples are given to further describe the present invention in detail. Materials, usage amounts, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed unless departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

Synthetic example 1

[0485] Diethylene glycol ethyl methyl ether (manufactured by Toho Chemical Industry Co., Ltd., HissolveEDM, 45 g) was added as a solvent to the three-necked flask, and the temperature was raised to 90° C. under a nitrogen atmosphere. In this solution, methyl methacrylate (MMA, manufactured by Wako Pure Chemical Industries, 3.27 g), 2-tetrahydrofuryl methacrylate (MATHF, synthetic product, 22.17 g), and hydroxyl group methacrylate were dissolved as monomer components. Ethyl ester (HEMA, manufactured by Wako Pure Chemical Industries, 6.57 g), 3-ethyl-3-oxetanylmethyl methacrylate (OXE-30, manufactured by Osaka Organic Chemical Industry, 20.26 g) and n-butoxymethyl Acrylamide (NBMA, manufactured by Tokyo Chemical Industry, 9.43 g), and 2,2'-azobis(2-methylpropionic acid) dimethyl (V-601, manufactured by Wako Pure Chemical Industries, Ltd., 7.36 g) as a polymerization initiator g, 8 mol% with respect to the monomer), it was dripped over 2 hours. It stirred for 2 hours after compl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an orthotype photosensitive resin composition, a hard coating film and a forming method thereof, an interlayer insulated film, and a display device. Various kinds of performance synthesis of the orthotype photosensitive resin composition are excellent. The orthotype photosensitive resin composition is characterized by comprising an alkali soluble resin containing butoxy methylacrylamide and so on and a radioactive ray sensing acid generator.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a method for forming a cured film, a cured film, an organic electroluminescence (electroluminescence, EL) display device, and a liquid crystal display device. More specifically, the present invention relates to a positive-type photosensitive resin suitable for forming planarizing films, protective films, or interlayer insulating films of electronic components such as liquid crystal display devices, organic EL display devices, integrated circuit devices, and solid-state imaging devices. A composition and a method for forming a cured film using the positive photosensitive resin composition. Background technique [0002] In thin film transistor (thin film transistor, hereinafter referred to as "TFT") type liquid crystal display element or magnetic head element, integrated circuit element, solid-state imaging element and other electronic components, in order to insulate between the wiring...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039G03F7/00G02F1/1333H01L27/32H01L21/027
CPCG03F7/00G03F7/004G03F7/0045G03F7/039G03F7/0392
Inventor 山田悟山﨑健太杉原幸一柏木大助川岛敬史霜山达也真崎庆央下野胜弘
Owner FUJIFILM CORP