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Method of preparing conductive ribs on a chassis, the chassis with conductive ribs, and method of assembling an electric device including the same

An assembly method and technology of electronic devices, which are applied in the directions of cabinets/boxes/drawer parts, electrical equipment casings/cabinets/drawers, electrical components, etc., can solve the problem of labor and cost, increase labor cost and manufacturing cost, Reduce the conductive foam conduction ability and other problems, to save manpower and cost, save material preparation and procurement process, and simplify the production process.

Inactive Publication Date: 2012-07-04
QUANTA COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the steps of wrapping the conductive tape on the outer body of the foam and placing the conductive foam inside the casing will both increase labor costs and manufacturing costs
In addition, conductive foams at different locations on the case have different models, styles, prices, and even different suppliers. In this way, when preparing and purchasing these conductive foams, the industry will consider its inventory and acquisition costs, resulting in waste Considerable manpower and cost
In addition, if the conductive adhesive tape has defects, it will reduce the conductive ability of the conductive foam, thereby weakening the computer's ability to prevent electromagnetic interference and electrostatic discharge

Method used

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  • Method of preparing conductive ribs on a chassis, the chassis with conductive ribs, and method of assembling an electric device including the same
  • Method of preparing conductive ribs on a chassis, the chassis with conductive ribs, and method of assembling an electric device including the same
  • Method of preparing conductive ribs on a chassis, the chassis with conductive ribs, and method of assembling an electric device including the same

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Embodiment Construction

[0042] The following will clearly illustrate the spirit of the present invention with illustrations and detailed descriptions. After those skilled in the art understand the embodiments of the present invention, they can be changed and modified by the technology taught in the present invention, which does not depart from the present invention. spirit and scope.

[0043] In view of the fact that the traditional manufacturing process needs to wrap the conductive adhesive tape on the foam body in advance before the step of arranging the conductive foam on the casing, the present invention directly forms a conductive coating on the inner surface of the casing and the surface of the elastic ribs, to simplify its fabrication process. In addition, not only the conductive coating of the casing can form a shielding element, but also after the conductive coating is formed on the surface of the elastic rib, the elastic rib can replace the conductive foam to touch and press a component and...

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Abstract

The invention discloses a method of preparing conductive ribs on a chassis, the chassis with conductive ribs, and a method of assembling an electric device including the same. The method of preparing conductive ribs on a chassis includes steps as follows. A plastic case is provided with at least one elastic rib integrally formed thereon. Then, a conductive film is formed to overlay on both an inner surface of the plastic case and the surfaces of the elastic rib. The present invention can decrease manpower and costs for preparing and purchasing the conductive foams.

Description

technical field [0001] The invention relates to an electromagnetic interference protection element, in particular to a method for preparing conductive convex ribs on a casing. Background technique [0002] In order to reduce the impact of Electromagnetic Interference (EMI) and Electrostatic Discharge (ESD) on the components inside the computer, traditional methods place a certain amount of conductive foam and conductive cloth (gasket) inside the case. , aluminum foil (Al foil) or copper foil (Cu foil), not only can provide metal shielding effect, but also guide the electromagnetic wave signal of this component to a ground terminal. [0003] For example, when placing the conductive foam inside the casing, the material of the conductive foam needs to be prepared first, because the conductive foam is formed by wrapping a foam body with a conductive adhesive tape. Therefore, when preparing the material of the conductive foam, it is necessary to wrap the conductive adhesive tape...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K5/02H05K9/00
CPCG06F1/182H05K9/0084H05K9/0092Y10T29/49002
Inventor 许志江江宗儒
Owner QUANTA COMPUTER INC