Air guiding cover and heat dissipation system with same

A heat dissipation system and air guide cover technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problem of inability to obtain fan airflow, affect the stability of expansion cards, and the heat of expansion cards cannot be timely and effectively Dispersion and other issues to achieve the effect of ensuring stability

Inactive Publication Date: 2012-07-11
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the expansion card is too long, it is usually placed outside the air guide cover, and the airflow output by the fan cannot be obtained. As a result, the heat of the expansion card cannot be dissipated in a timely and effective manner, thereby affecting the stability of the expansion card.

Method used

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  • Air guiding cover and heat dissipation system with same
  • Air guiding cover and heat dissipation system with same
  • Air guiding cover and heat dissipation system with same

Examples

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Embodiment Construction

[0038] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0039] see figure 1 and figure 2 , is the heat dissipation system 100 provided by the embodiment of the present invention. The heat dissipation system 100 includes a motherboard 10 , a wind deflector 20 , a first heat source 30 , a heat sink 40 , a socket 50 , a second heat source 60 and two fans 70 . The air guide cover 20 , the first heat source 30 , the heat sink 40 , the socket 50 , the second heat source 60 and the two fans 70 are all disposed on the motherboard 10 .

[0040] Please combine image 3 , the wind deflector 20 includes a top wall 22 , a first side wall 24 , a second side wall 26 , a shielding assembly 27 , a first wind deflector 28 and a second wind deflector 29 .

[0041] The first sidewall 24 and the second sidewall 26 vertically extend from two sides of the top wall 22 . The first side wall 24 , the second side wa...

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PUM

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Abstract

The invention relates to an air guiding cover which comprises a top wall, two side walls and a shielding component, wherein the two side walls are connected at the two sides of the top wall, and the shielding component is arranged on the top wall. A ventilating duct through which air current passes is surrounded by the top wall and the two side walls. The air guiding cover comprises an air inlet, a first air outlet and a second air outlet, wherein the air inlet and the first air outlet are arranged at the two opposite ends of the ventilating duct; and the second air outlet is arranged on the top wall and is opposite to the air inlet. The shielding component is used for selectively shielding or opening the second air outlet. When the shielding component is opened by using the shielding component, air current flowing into the air inlet flows towards one end of the air guiding cover far away from the air inlet from the first air outlet and the second air outlet. The invention also relates to a heat dissipation system with the air guiding cover.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to an air guide cover and a heat dissipation system with the air guide cover. Background technique [0002] As the functions of computer systems become more and more powerful, the degree of integration inside them becomes higher and higher. In addition to traditional components such as a central processing unit (Central Processing Unit, CPU) and a graphics card, the computer system is equipped with some expansion cards to enhance its functions. The CPU, graphics card, and expansion card will generate a lot of heat. If the heat is not dissipated in a timely and effective manner, the computer may malfunction or even be damaged due to overheating. To do this, fans are placed inside the computer to help cool the computer. [0003] In order to improve the airflow efficiency of the fan, an air guide cover is usually provided to guide the airflow generated by the fan to the heating compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
Inventor 赖昱嘉
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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