Cleaning method and cleaning and drying equipment for improving cleanness of wafer
A technology for cleanliness and wafers, applied in cleaning methods and tools, cleaning methods using liquids, chemical instruments and methods, etc., can solve the problems affecting the cleanliness, yield and reliability of wafers, and the cleanliness of wafer surfaces , Impurities cannot be completely removed and other problems, to achieve the effect of simple and easy improvement, reducing the possibility of liquid residue, and avoiding the effect of liquid residue
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0031] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings of the specification. Of course, the present invention is not limited to this specific embodiment, and general replacements well known to those skilled in the art are also covered by the protection scope of the present invention.
[0032] Secondly, the present invention uses schematic diagrams to describe in detail. When describing the examples of the present invention, for convenience of explanation, the schematic diagrams are not partially enlarged according to the general scale and should not be used as a limitation to the present invention.
[0033] figure 2 It is a schematic flowchart of a method for cleaning and spinning a wafer in an embodiment of the present invention. Combine figure 2 , The present invention provides a cleaning and spin-drying method capable of imp...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap