Focusing type light beam compression method for semiconductor laser and device for realizing focusing type light beam compression method
A compression method and semiconductor technology, applied in the direction of instruments, optics, optical components, etc., can solve the problems of inconvenient installation and debugging, increase optical loss, etc., achieve reliable performance, reduce the number of uses, and improve application reliability
Active Publication Date: 2014-08-20
SANHE LASERCONN TECH CO LTD
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However, this method will cause the increase of additional optical devices, increase the optical loss, and also bring inconvenience to installation and debugging.
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[0048] As mentioned above, in the prior art, in order to reduce the spot size, a cylindrical lens is often used for further beam compression after collimation. However, there are defects such as high implementation cost and large optical loss. Through theoretical research and repeated experiments, the inventors proposed a novel and unique technical idea—by slightly adjusting the fast-axis collimator around its focal point at a small angle, the beam deflection after the collimation of a single semiconductor laser array is realized, and then realized Focusing beams from multiple semiconductor laser arrays in the same stack over a predetermined distance (or reducing the spacing between linear spots) ultimately achieves overall compression of the spot size.
[0049] The above-mentioned method of directly realizing beam compression in the fast-axis collimation process is called focused fast-axis collimation. The specific description will be launched below in conjunction with the a...
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Abstract
The invention discloses a focusing type light beam compression method for a semiconductor laser and a device for realizing the focusing type light beam compression method. The focusing type light beam compression method comprises the following steps of: setting a fast axis collimating device on an output optical path of the semiconductor laser; enabling an optical center of the fast axis collimating device to do small-angle rotation towards a central position around a corresponding light-emitting point with a focal distance as a radius; and keeping the direction of the output optical path superposed with a connecting line between the optical center and the corresponding light-emitting point in the rotating process. All beams can be collected to a line within a preset distance by adjusting a rotating angle of the fast axis collimating device one by one, which corresponds to each semiconductor laser array. According to the focusing type light beam compression method disclosed by the invention, the focusing of the output beams can be directly realized while the fast axis is collimated, so that the use amount of optical devices is reduced, the application reliability of the semiconductor laser arrays is improved and the optical loss caused by introduction of an extra optical device is avoided.
Description
technical field [0001] The invention relates to a laser beam compression method, in particular to a focused laser beam compression method for a semiconductor laser, and also to an optical device for realizing the beam compression method, which belongs to the technical field of laser beam shaping. Background technique [0002] Semiconductor lasers can achieve a photoelectric conversion efficiency of 40-70%, and are currently one of the laser devices with the highest photoelectric conversion efficiency. They are widely used in laser processing, medical cosmetology, military industry and other fields. The semiconductor laser array is a linear light source composed of multiple semiconductor laser light-emitting points. Multiple semiconductor laser arrays are vertically stacked and packaged to form a semiconductor laser stack. Its far-field superimposed spot is not particularly different from a single semiconductor laser, but it can aggregate the emission power of multiple semico...
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IPC IPC(8): G02B27/09G02B1/11
Inventor 李阳李德龙
Owner SANHE LASERCONN TECH CO LTD