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Thermosetting fluoropolyether adhesive composition and adhesion method

一种含氟聚醚、粘合剂的技术，应用在聚醚粘合剂、粘合剂加热的粘合方法、粘合方法等方向，能够解决组合物粘性损失等问题，达到优异粘结性、优异粘附耐久性的效果

Inactive Publication Date: 2012-07-25
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the composition is left at a relatively high temperature below 100°C, such as 80°C, for a long time, the composition has a problem of complete loss of viscosity

Method used

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  • Thermosetting fluoropolyether adhesive composition and adhesion method
  • Thermosetting fluoropolyether adhesive composition and adhesion method
  • Thermosetting fluoropolyether adhesive composition and adhesion method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0204] In 100 parts of the polymer represented by the following formula (13) (viscosity, 10000mPa·s; vinyl content, 0.012mol / 100g), add 5.0 parts of hydrophobic fumed silica R-976 (product name, NipponAerosil Co ., Ltd production, with 250m 2BET specific surface area per g), 1.2 parts of fluorine-containing organohydrogenpolysiloxane (SiH group content, 0.0067mol / g) represented by the following formula (14), 1.8 parts of fluorine-containing organic group represented by the following formula (15) Hydrogenpolysiloxane (SiH group content, 0.0039 mol / g), 0.35 parts of platinum-divinyltetramethyldisiloxane complex in toluene solution (platinum content, 0.5% by weight), 7.0 parts of the following average composition Fluorine-containing organohydrogenpolysiloxane represented by formula (16), 0.25 parts of an organic compound represented by the following formula (17), 0.20 parts of an organosilicon compound represented by the following formula (18), 0.10 parts of the organic compound ...

Embodiment 2

[0209] The procedure of Example 1 was repeated except that the fluorine-containing organohydrogenpolysiloxane represented by the average composition formula (16) was replaced with 9.0 parts of the fluorine-containing organohydrogenpolysiloxane represented by the following average composition formula (21), and The adhesive test piece was prepared using the composition thus prepared. The procedure of Example 1 was repeated to evaluate the bond strength (shear bond strength) and the percentage of cohesive failure. The results are shown in Table 1. The bond strength (shear bond strength) and the percentage of cohesive failure after the test piece was left at 150° C. for 1000 hours were also evaluated. The results are shown in Table 5.

[0210]

Embodiment 3

[0212] The procedure of Example 1 was repeated except that 5.0 parts of the fluorine-containing organohydrogenpolysiloxane represented by the average composition formula (21) was additionally used, and the composition thus prepared was used to prepare an adhesive test piece. The procedure of Example 1 was repeated to evaluate the bond strength (shear bond strength) and the percentage of cohesive failure. The results are shown in Table 1. After the test piece was left at 150° C. for 1000 hours, the bond strength (shear bond strength) and the percentage of cohesive failure were measured. The results are shown in Table 5.

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Abstract

A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100 DEG C, and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150 DEG C. A method for adhering the composition to the substrate is also provided. The composition comprises (A) a straight chain polyfluoro compound, (B) a fluorine-containing organohydrogenpolysiloxane containing at least 2 SiH groups and not containing other functional group, (C) a platinum group metal catalyst, (D) a fluorine-containing organohydrogenpolysiloxane containing a fluorine-containing organic group, SiH group, epoxy group and / or tri(organoxy)silyl group, and an aryl group, (E) a polyhydric allyl ester compound, (F) an organosilicon compound having epoxy group and an organoxy group, and not containing SiH group, and (G) an organosilicon compound having SiH group and an aryl group, and not containing epoxy group or a tri(organoxy)silyl group, or a fluorine-containing organic group.

Description

technical field [0001] The present invention relates to a thermosetting fluorine-containing polyether adhesive composition with excellent adhesion to metal, inorganic and plastic substrates, in particular to a thermosetting fluorine-containing polyether adhesive composition, which can pass through the When heated at ℃, the composition cures and is resistant to inorganic materials such as metals, such as aluminum or alumina ceramics, and plastic materials such as polybutylene terephthalate (PBT) resins and polyphenylene sulfide (PPS) resins. It exhibits excellent adhesion and has excellent adhesion durability at temperatures up to 150°C. The invention also relates to a method for bonding an adhesive composition to a metal, inorganic or plastic substrate. Background technique [0002] Japanese Patent No. 2990646 discloses the application of a composition comprising a straight-chain fluorine-containing polyether compound having at least two alkenyl groups in the main chain of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J171/00C09J183/08C09J183/05C09J11/06C09J5/06
CPCC09J183/04C08G2650/48C08G65/007C09J171/00C08G77/24C08L83/04C09J5/00C09J11/04C09J129/10
Inventor 越川英纪盐野巳喜男
Owner SHIN ETSU CHEM CO LTD
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