Method for controlling temperature of single plate

Abstract

The invention provides a method for controlling the temperature of a single plate. In each detection period, a main control panel is used for detecting the temperature of a main control panel, the temperature of each single plate, the field programmable gata array (FPGA) junction temperature of each single plate, and the working condition of a fan, when the temperature of the main control panel exceeds preset disconnection temperature, the disconnections of all the single plate are controlled by the main control panel; and when the temperature of the single plate or the FPGA junction temperature exceeds the preset disconnection temperature, the disconnection of the single plate is controlled by the main control panel. According to the method for controlling the temperature of the single plate, the working condition of the single plate is controlled by combining a plurality of parameters, such as the temperature of the main control panel, the temperature of the single plate, the FPGA junction temperature and the working condition of the fan, therefore, the high temperature protection and recovery can be effectively carried out on the single plate, and invalidation of high temperature protection caused by the invalidation of each device, such as sensors and the like can be avoided.

Description

technical field [0001] The invention relates to heat dissipation technology in the field of electronics or communication, in particular to a method for controlling the temperature of a single board. Background technique [0002] In the context of continuous upgrading and integration of communication equipment, the heat density of circuit boards is getting higher and higher. In communication equipment with limited space, the problem of heat dissipation is becoming more and more difficult. The usual method of only relying on heat sinks is difficult to meet the heat dissipation requirements, and the use of fans for forced cooling is currently a more effective and convenient method. [0003] Taking the baseband single board of the baseband processing unit (BBU) as an example, there are many devices such as CPU, digital signal processor (DSP) and field programmable gate array chip (FPGA) on it, and the heat generation is relatively large. When a fan fails, there is a risk that t...

AI Technical Summary

Problems solved by technology

[0012] (1) This temperature control method only takes the working status of all fans and the temperature of the main control board as the control conditions, and when the baseband single board is abnormal, the main control board cannot respond accordingly, which may easily lead to the burning of the baseband single board

And if the temperature sensor of the main control board fails, there will be a risk of false positives or invalidity;

[0013] (2) The detection period of this temperature control method is fixed. When the temperature rises rapidly, the main control board cannot detect the current temperature and the working status of the fan in time, and may not be able to follow the temperature change in time, resulting in the burning of the baseband board;

[0014] (3) This temperature control method can only realize the protection of the baseband single board by powering off, but cannot restore the power supply of the baseband single board when the temperature returns to the normal range, causing delays and other effects on its normal working state

Images