Supercharge Your Innovation With Domain-Expert AI Agents!

Substrate fixing device and manufacturing method thereof and method for fixing substrate

A technology for fixing devices and fixing substrates, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, electrical components, etc., can solve problems such as inability to fix, fix difficulties, etc., to ensure accurate positioning, expand the scope of application, and solve the problem of processing misalignment Effect

Inactive Publication Date: 2015-06-24
BOE TECH GRP CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to solve the problem that in the prior art OLED display equipment manufacturing process, the same substrate is difficult or impossible to fix due to the inconsistency of the substrate bracket size of the process equipment between different process equipment, and to provide a Any type of substrate can be effectively fixed and accurately aligned on substrate brackets of different sizes in different process equipment, and a method for fixing the substrate in the process equipment using the substrate fixation device, and also relates to The manufacturing method of the substrate fixing device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate fixing device and manufacturing method thereof and method for fixing substrate
  • Substrate fixing device and manufacturing method thereof and method for fixing substrate
  • Substrate fixing device and manufacturing method thereof and method for fixing substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] The problem in this embodiment is that during the substrate preparation process of the OLED display device developed in the laboratory, the external dimensions of the substrate 1 are suitable for the size of the substrate bracket in the substrate preparation equipment, so the substrate 1 can be well fixed On the substrate holder in the substrate preparation equipment; however, the size of the substrate holder in the evaporation equipment is larger than the size of the substrate holder in the substrate preparation equipment, thus making the size of the substrate 1 smaller than that of the substrate holder in the evaporation equipment size, if the substrate 1 after the substrate preparation process is directly fixed on the substrate bracket of the evaporation equipment, the substrate is likely to be unstable during the evaporation process, so that the evaporation of the display device on the substrate is dislocated, and ultimately affects Processing quality of substrate 1....

Embodiment 2

[0100] The difference between this embodiment and Embodiment 1 is that the shape of the substrate bracket in the evaporation equipment is circular, so the shape of the positioning plate 2 is a circle suitable for the shape of the substrate bracket in the evaporation equipment. The shape of the positioning groove 3 and the positioning protrusion 4 on the positioning plate 2 is a conical shape that matches.

[0101] Other structures and manufacturing processes in this embodiment are the same as those in Embodiment 1, and will not be repeated here.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed in the invention is a substrate fixing device, which is used for fixing a substrate (1) in processing equipment. The substrate accommodation groove (13) is arranged on the surface of the substrate fixing device to fix the substrate (1); and the overall dimension of the substrate fixing device is arranged as one enabling the device itself to be fixed on the processing equipment. Besides, provided is a method for fixing a substrate. According to the invention, the substrate fixing devices are employed on different processing equipment, so that an adaptive range of a same substrate to the different processing equipment is enlarged, accurate positioning of the substrate on the different processing equipment is ensured and a problem of dislocation caused by dimension inconsistency between the same substrate and substrate brackets of the different processing equipment can be solved.

Description

technical field [0001] The invention belongs to the technical field of flat panel display equipment manufacturing, and specifically relates to a substrate fixing device and a method for fixing a substrate in a process equipment during the display device manufacturing process, and also relates to a manufacturing method of the substrate fixing device. Background technique [0002] Organic electroluminescent devices, also known as organic light emitting diodes (Organic Light Emitting Diode, referred to as OLED), are a new type of flat panel display device. Compared with liquid crystal display devices, OLED has active light emission, low driving voltage, low power consumption, High luminous brightness and efficiency, ultra-thin, simple manufacturing process, easy to realize full-color flat panel display and flexible display, large viewing angle and wide operating temperature range, etc., are considered to be emerging application technologies for the next generation of flat panel ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687H01L51/56
Inventor 王玉林
Owner BOE TECH GRP CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com