Heat pipe with compounding capillary and manufacturing method thereof

Abstract

The invention discloses a heat pipe with a compounding capillary and a manufacturing method of the heat pipe. The heat pipe with the compounding capillary comprises a first pipe body, a second pipe body, a third capillary structure, an operating fluid, an evaporation section, a condensing section and a transmission section, wherein the inner wall of the first pipe wall is provided with a first capillary structure; the evaporation section is formed on the one side of the first pipe body, the condensing section is formed on the other side of the first pipe body, and the transmission section is formed on the first pipe body and is arranged between the evaporation section and the condensing section; the second pipe body is placed in the first pipe body and positioned on the transmission section, and the outer wall of the second pipe body is provided with a second capillary structure; the third capillary structure is arranged between the first capillary structure and the second capillary structure, and the operating fluid is hermetically filled in the first pipe body; and therefore, when the interior operating fluid is condensed into liquid, and the liquid can rapidly reflow to the evaporation section from the condensing section through the transmission section. The invention also provides a manufacturing method of the heat pipe with the compounding capillary.

Description

technical field [0001] The invention relates to a heat pipe, in particular to a heat pipe with composite capillary and a manufacturing method thereof. Background technique [0002] The heat pipe heat sink obtained by combining the heat pipe (heat pipe) with the cooling fin group can effectively overcome the heat dissipation problem of the processor with increasing heat, so these heat pipe heat sinks have gradually replaced the previous heat sink and fan. cooling device. However, the existing heat pipes still have problems to be solved such as the increase of the transmission speed and the slow return of the internal working fluid. The present invention uses the aforementioned problems to be overcome to innovate and improve the heat pipe. [0003] The existing heat pipe mainly includes a metal pipe body, a capillary structure and a working fluid, wherein the metal pipe body has a sealed cavity, the capillary structure ring is attached to the inner wall of the metal pipe body...

AI Technical Summary

Problems solved by technology

[0004] However, although the existing heat pipes can transfer heat by using the vapor-liquid phase change, their capillary structure is a single-layer type, and the speed at which the liquid can flow back is limited by its inherent conditions.

In addition, since the flow direction of the gas and the flow direction of the liquid are in the opposite direction, and they are arranged in close proximity to each other, there will be mutual interference in the adjacent area of ​​the gas passage and the liquid return channel, thus reducing the flow of the gas The speed and the return velocity of the liquid are one of the main reasons why its heat conduction performance cannot be greatly improved.

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